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2026-06-11
drrobertcastellano.substack.com
2026-06-11
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
The Best-of-Breed Divide in Semiconductor Equipment Is Becoming Clearer
DR. ROBERT CASTELLANO
JUN 11, 2026
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The Semiconductor Equipment Market Is No Longer Moving in Unison
Applied Materials Lost Leadership Despite Industry Growth
Table 1: Semiconductor Equipment Revenues for Applied Materials and ASML (2015–2025)
Chart 1: Applied Materials Share of Global WFE Ma
2026-06-10
autonews.gasgoo.com
2026-06-10
Gasgoo
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Cockpit-Driving Fusion, Qualcomm Unveils Another Major Move
Qualcomm
Cockpit-Driving Fusion, Qualcomm Unveils Another Major Move
Edited by Taylor From Gasgoo
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June 10 , 2026 22:06 BJT
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Gasgoo Munich-In Wuxi this June, cockpit-driving fusion took center stage at the 2026 Qualcomm Automotive Technology and Cooperation Summit. The Snapdragon 8775 has entere
2026-06-10
www.foreignpolicyjournal.com
2026-06-10
foreignpolicyjournal.com
Nebius Group (NASDAQ: NBIS) shares climbed more than 5% on Tuesday after the AI cloud company unveiled a new Physical AI Living Lab developed in partnership with NVIDIA (NASDAQ: NVDA).
The initiative marks a significant expansion of the existing relationship between the two companies, targeting the fast-growing market for AI-driven robotics applications across the UK and Europe.
Iran launches re
2026-06-10
news.google.com
2026-06-10
Business Wire
2026-06-10
news.google.com
2026-06-10
Insider Monkey
2026-06-10
digitimes.com
2026-06-10
YMTC and CXMT have returned to Washington's Chinese Military Companies list, placing China's two leading memory chipmakers back at the center of US scrutiny over semiconductors, military-civil fusion, and China's technology supply chain.
2026-06-10
digitimes.com
2026-06-10
At COMPUTEX 2026, held under the theme "AI Together," a clear shift was visible across the exhibition floor: the focus has moved beyond individual chips and server specifications toward a far more practical challenge — how to rapidly deploy full-scale computing infrastructure under tight constraints of power, time, and construction capacity.
2026-06-10
defence-industry.eu
2026-06-10
Defence Industry Europe
Northrop Grumman develops new GaN chip for secure W-band links and next-generation wireless connectivity
By Martin Chomsky (Defence Industry Europe)
INDUSTRY SPOTLIGHT
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June 9, 2026
Photo: Northrop Grumman.
Northrop Grumman has developed a new Gallium Nitride chip designed to improve performance for military and commercial radio frequency applications. The company said the chip sets a new sta
2026-06-10
www.marketwatch.com
2026-06-10
MarketWatch
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2026-06-09
news.google.com
2026-06-09
Stock Titan
2026-06-09
sg.finance.yahoo.com
2026-06-09
Yahoo Finance Singapore
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Applied Materials Announces Cash Dividend
Applied Materials, Inc.
Tue, 9 June 2026 at 4:35 am GMT-7 2 min read
AMAT
+0.60%
Applied Materials, Inc.
SANTA CLARA, Calif., June 09, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that its Board of Directors has approved a quarterly cash di
2026-06-09
wifinowglobal.com
2026-06-09
Wi-Fi NOW Global
Qualcomm’s new Dragonwing MBM silicon solution combines interactive multimedia with top-tier connectivity & on-device AI
June 9, 2026 | INTELLIGENT CONNECTIVITY | by Claus Hetting, Wi-Fi NOW CEO & Chairman
By Claus Hetting, WiFi NOW CEO & Chairman
It is not often that major chipset vendors introduce an entirely new class of AI-enabled connectivity platforms but Qualcomm did exactly that only tw
2026-06-09
nebius.com
2026-06-09
Nebius
London, June 9, 2026 — Nebius, the AI cloud company, today announced the Physical AI Living Lab, a six-month program that equips British and European robotics startups with NVIDIA’s physical AI development tools and Nebius’s AI cloud infrastructure.
Physical AI depends on large-scale simulation, synthetic data, and accelerated compute that most early-stage robotics companies cannot assemble on th
2026-06-09
news.google.com
2026-06-09
Stock Titan
2026-06-09
finance.yahoo.com
2026-06-09
Yahoo Finance
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2026-06-09
digitimes.com
2026-06-09
Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue to expand. The comment was made by Samsung Electronics co-CEO and head of the Device Solutions (DS) division Young-hyun Jun following talks with Nvidia CEO Jensen Huang and senior executives at The Shilla hotel in Jun
2026-06-09
digitimes.com
2026-06-09
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
2026-06-08
eetimes.com
2026-06-08
AI transforms intra-data center networking, accelerating optical innovation while extending decades-long evolution in high-performance connectivity.
2026-06-08
news.google.com
2026-06-08
foreignpolicyjournal.com
2026-06-08
digitimes.com
2026-06-08
Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.