Semiconductor News & Analysis Feed

43 articles
2026-07-03
digitimes.com 2026-07-03
With supply chain inventory normalization largely complete, Sonix Technology (Sonix) has seen business momentum recover. The MCU supplier is benefiting from resilient demand for microcontrollers used in medical monitoring devices and steady shipments of multimedia image-processing chips, giving it better order visibility for 2026 than in previous years. Meanwhile, the company's drone business has
2026-07-02
evertiq.com 2026-07-02 Evertiq
© tsmc Electronics Production | July 02, 2026 TSMC and Sony sign MOU for next-generation image sensor JV Evertiq TSMC and Sony Semiconductor Solutions have signed a non-binding memorandum of understanding to form a strategic partnership for the development and manufacturing of next-generation image sensors. The two companies intend to establish a joint venture at Sony's newly constructed fab in K
2026-06-30
digitimes.com 2026-06-30
Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.
2026-06-17
www.sony-semicon.com 2026-06-17 sony-semicon.com
Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the LYTIA L910, an approximately 50-effective megapixel*1 image sensor for mobile applications delivering 100 dB high dynamic range imaging with low power consumption. This is the first product in the LYTIA lineup with the LOFIC*2 structure. It also features the new HDR technology and logic circuit technology
2026-06-15
digitimes.com 2026-06-15
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i
2026-06-09
www.phoronix.com 2026-06-09 Phoronix
Fedora 44 RISC-V Images Released, Including New "Omni" Kernel For Broader RISC-V Hardware Support Written by Michael Larabel in Fedora on 8 June 2026 at 08:25 PM EDT. Add A Comment Following the official Fedora 44 images released one month ago, Fedora 44 RISC-V images were published today for those wanting to run this newest Fedora Linux on RISC-V hardware. RISC-V images of Fedora 44 are now avai
2026-06-08
finance.yahoo.com 2026-06-08 Yahoo Finance
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2026-06-05
news.google.com 2026-06-05 South China Morning Post
2026-06-04
www.strata-gee.com 2026-06-04 Strata-gee.com
Sony Partners with Chip Giant TSMC to Develop Next-Gen AI Image Sensors JUNE 4, 2026 BY TED LEAVE A COMMENT Sony Group recently announced it is forming a co-development partnership with chip manufacturing giant Taiwan Semiconductor Manufacturing Company (TSMC) to create what it calls the next generation of AI image sensors. In announcing the partnership, the company revealed that, with these nex
2026-06-03
www.eurekalert.org 2026-06-03 EurekAlert!
Power module with 1200-V-class GaN transistors (IMAGE) FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS Facebook X LinkedIn WeChat Bluesky Message WhatsApp Email CAPTION Close-up of the power module developed and manufactured at Fraunhofer IAF, featuring 1200-V-class GaN transistors on an insulating substrate for use in bidirectional DC charging systems CREDIT © Fraunhofer IAF USAGE RE
2026-06-03
www.eurekalert.org 2026-06-03 EurekAlert!
Bidirectional single-phase 3-kW DC charger (IMAGE) FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS Facebook X LinkedIn WeChat Bluesky Message WhatsApp Email CAPTION Demonstrator of a bidirectional single-phase 3-kW DC charger with GaN power electronics. Researchers at Fraunhofer IAF developed the power electronics module (top) using gallium nitride (GaN) power semiconductors and alternat
2026-05-29
digitimes.com 2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-26
tomshardware.com 2026-05-26 Kunal Khullar
The Holo 360 replaces conventional LCD layering with a floating hologram-like image effect.
2026-05-15
evertiq.com 2026-05-15 Evertiq
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2026-05-13
pulse2.com 2026-05-13 Pulse 2.0
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2026-05-12
semiengineering.com 2026-05-12 Semiconductor Engineering
A new technical paper, “CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation,” was published by researchers at Seoul National University, Sungkyunkwan University, Hanyang University, Sogang University, and SK Hynix.Abstract“Recent progress in generative modeling has intensified the need for compact, energy-efficient hardware
2026-05-12
pulse2.com 2026-05-12 Pulse 2.0
Indie Semiconductor has announced a definitive agreement to acquire the fabless CMOS image sensor group from ams OSRAM AG for total consideration of €40 million, comprising a €35 million cash payment at closing and a €5 million vendor-debt note issued by ams OSRAM. The transaction is expected to close in the third quarter of 2026, subject to customary closing conditions, including regulatory appro
2026-05-11
www.photonics.com 2026-05-11 Photonics Spectra
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2026-05-11
www.imveurope.com 2026-05-11 Imaging and Machine Vision Europe
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2026-05-11
finance.yahoo.com 2026-05-11 Yahoo Finance
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