Semiconductor News & Analysis Feed

167 articles
2026-06-08
www.theinformation.com 2026-06-08 The Information
Big Read: SpaceX’s CFO Is the Quiet VIP of a Wild IPO  Save 25% to unlock this story Unlimited access to our journalism, newsletters, charts and data library, and event discounts. Annual + Deep Research, 60+ org charts, proprietary databases and survey results. Search, find and engage with others who are serious about tech and business. Follow and be a part of discussions about tech, finance a
2026-06-08
www.bisinfotech.com 2026-06-08 Bisinfotech
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2026-06-08
www.bisinfotech.com 2026-06-08 Bisinfotech
Home/ Semiconductor Component/ Automotive Electronics/Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices Vaishali Chauhan June 8, 2026 2 minutes read Power conversion architectures in automotive and industrial applications are evolving rapidly, placing new demands on switching topologies, thermal management, and system integ
2026-06-07
world.infonasional.com 2026-06-07 world.infonasional.com
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2026-06-07
digitimes.com 2026-06-07
Transcend Information said revenue for April and May combined has already surpassed its first-quarter total, as tight memory supply and elevated prices continue to lift sales at the Taiwan-based memory module maker.
2026-06-07
digitimes.com 2026-06-07
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus, the national semiconductor champion formed to commercialize advanced node chips, to fund plant construction, equipment and research for 2nm and 1.4nm chips. The funding was executed through the Information-Technolog
2026-06-06
www.bisinfotech.com 2026-06-06 Bisinfotech
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2026-06-04
news.google.com 2026-06-04 Bisinfotech
2026-06-04
www.bisinfotech.com 2026-06-04 Bisinfotech
Home/ Semiconductor Component/Infineon Launches EiceDRIVER Gate Driver for AI Datacenters Infineon Launches EiceDRIVER Gate Driver for AI Datacenters Vaishali Chauhan June 4, 2026 2 minutes read Infineon Technologies AG introduces the EiceDRIVER 2EDL90xG3, a 120 V common footprint gate driver designed to enable silicon (Si) and gallium nitride (GaN) power designs on the same PCB. As AI datace
2026-06-04
www.theinformation.com 2026-06-04 The Information
Anthropic’s Mythos Is a Security Powerhouse. It’s Also a Budget Buster  Save 25% to unlock this story Unlimited access to our journalism, newsletters, charts and data library, and event discounts. Annual + Deep Research, 60+ org charts, proprietary databases and survey results. Search, find and engage with others who are serious about tech and business. Follow and be a part of discussions abou
2026-06-04
www.theinformation.com 2026-06-04 The Information
Anthropic’s Mythos Is a Security Powerhouse. It’s Also a Budget Buster  Save 25% to unlock this story Unlimited access to our journalism, newsletters, charts and data library, and event discounts. Annual + Deep Research, 60+ org charts, proprietary databases and survey results. Search, find and engage with others who are serious about tech and business. Follow and be a part of discussions abou
2026-06-03
www.bisinfotech.com 2026-06-03 Bisinfotech
Home/ Semiconductor Component/ Power Electronics/ AC-DC / DC-DC / Converters/TDK presents DC-link capacitors with ultra-low inductance for SiC-based power electronics TDK presents DC-link capacitors with ultra-low inductance for SiC-based power electronics Vaishali Chauhan June 3, 2026 2 minutes read TDK Corporation presents the B25696H series of MKP DC high-frequency (HF) film capacitors, a
2026-06-03
www.bisinfotech.com 2026-06-03 Bisinfotech
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2026-06-03
www.bisinfotech.com 2026-06-03 Bisinfotech
Home/ Data Center/Infineon Expands SiC Solutions for AI Data Centers Infineon Expands SiC Solutions for AI Data Centers Vaishali Chauhan June 3, 2026 2 minutes read Infineon Technologies AG is expanding its CoolSiC JFET portfolio in response to growing demand from AI data centers and the shift towards solid-state power protection. With new devices, package options and configurations, the comp
2026-06-03
www.bisinfotech.com 2026-06-03 Bisinfotech
Home/ Semiconductor Component/ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance Vaishali Chauhan June 3, 2026 2 minutes read ROHM Co., Ltd. has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI,
2026-06-03
news.google.com 2026-06-03 Longbridge
2026-06-03
www.bisinfotech.com 2026-06-03 Bisinfotech
Home/ Semiconductor Component/ Power Electronics/ AC-DC / DC-DC / Converters/Infineon Unveils 24 kW SiC Backup Unit for AI Data Centers Infineon Unveils 24 kW SiC Backup Unit for AI Data Centers Vaishali Chauhan June 3, 2026 2 minutes read Infineon Technologies AG introduces a 24-kW battery backup unit (BBU) DC-DC reference design for high-voltage (HV) DC bus architectures in artificial intel
2026-06-03
tomshardware.com 2026-06-03 Zhiye Liu
Reputable Intel hardware leaker Jaykihn reveals new information about Intel's next-generation LGA1954 socket.
2026-06-02
www.bisinfotech.com 2026-06-02 Bisinfotech
Home/ Semiconductor Component/ Power Electronics/ AC-DC / DC-DC / Converters/Rutronik Unveils Integrated GaN Evaluation Platform for Next-Gen Motor Drives Rutronik Unveils Integrated GaN Evaluation Platform for Next-Gen Motor Drives Vaishali Chauhan June 2, 2026 2 minutes read image credits: electronics journal A new highly integrated evaluation platform from Rutronik that is designed to spee
2026-06-02
www.bisinfotech.com 2026-06-02 Bisinfotech
Home/ Semiconductor Component/Cadence, Samsung Expand Alliance for 2nm Chip Development Cadence, Samsung Expand Alliance for 2nm Chip Development Vaishali Chauhan June 2, 2026 2 minutes read Image Credits: New Electronics Samsung Foundry and Cadence Design Systems have reached an important agreement expanding on their long-term relationship. It includes a new project for delivering state-of-t