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SK Hynix has broken ground on a $4 billion advanced memory-packaging facility in Indiana, marking a significant step in its U.S. market expansion. The 133.5-acre plant in West Lafayette is set to begin mass production of next-generation high-bandwidth memory (HBM) in the second half of 2029, support

SK Hynix held a groundbreaking ceremony for a $4 billion AI chip packaging facility in West Lafayette, Indiana, marking a major expansion of its U.S. operations amid surging demand for high-bandwidth memory (HBM) driven by artificial intelligence. The facility, expected to begin cleanroom operations

SK Hynix's establishment of a chip packaging facility in Indiana represents a significant milestone in US semiconductor supply chain development. The facility will produce high-bandwidth memory (HBM), a critical component for high-performance computing and AI applications. This investment aligns wit

SK Hynix has officially initiated construction of its advanced packaging production facility in West Lafayette, Indiana, marking a significant step in its U.S. semiconductor strategy. The $3.87 billion investment, set to begin mass production of high-bandwidth memory (HBM) and AI-related memory prod