Semiconductor News & Analysis Feed
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2026-05-29
www.digitimes.com
2026-05-29
digitimes
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
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2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.
2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
2026-05-29
www.technetbooks.com
2026-05-29
Technetbook
Home News
Intel Fellow Ravi Mahajan on how EMIB and Advanced Packaging Drive Modern AI Computing
Intel Foundry Advanced Packaging Evolution and EMIB Development for Artificial Intelligence Workloads and Future Semiconductor Architecture Solutions
The semiconductor industry is at a turning point where shrinking transistors is no longer sufficient to support the massive computational power needed
2026-05-29
www.tweaktown.com
2026-05-29
TweakTown
NVIDIA's Arm-based 'Vera' CPU benchmarked, beats Intel Xeon and AMD EPYC CPUs
NVIDIA's upcoming 'Vera' CPU delivers a 1.63x performance uplift over last-gen Grace and is also faster than the top EPYC and Xeon CPUs.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published May 28, 2026 1:25 PM CDT
2 minutes & 45 seconds read time
TL;DR: NVIDIA's Vera CPU, featuring 88 custom Armv9.2 cores and advanced
2026-05-28
tomshardware.com
2026-05-28
Jake Roach
Intel has revealed the Arc G3 and G3 Extreme chips, which are built on Panther Lake dies with up to an Arc B390 iGPU. The chips will show up in devices from partners like Acer and OneXPlayer.
2026-05-28
tomshardware.com
2026-05-28
Matt Safford
Acer's Atlas 8 takes on AMD’s dominance in the space with the new Intel Arc G3 and G3 Extreme processors, packing Arc B370 or B390 iGPUs.
2026-05-28
www.barrons.com
2026-05-28
Barron's
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2026-05-28
www.barrons.com
2026-05-28
Barron's
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2026-05-28
www.msn.com
2026-05-28
MSN
Micron Technology and Intel have been the twin stars of the artificial-intelligence trade this year. But there are reasons to think Micron and its memory-chip peers are the more attractive AI play, according to D.A. Davidson analysts.
The share prices of Micron and Intel have each more than tripled this year so far on the back of surging demand for memory chips and central-processing units, respe
2026-05-28
intellectia.ai
2026-05-28
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Broadcom Emerges as a New Giant in AI Chip Market
Broadcom Emerges as a New Giant in AI Chip Market
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2026-05-28
digitimes.com
2026-05-28
Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design automation (EDA), hardware-assisted verification, and intellectual property (IP) products, supporting a higher fiscal 2026 revenue outlook and reinforcing the company's position in AI-related semiconductor development.
2026-05-28
digitimes.com
2026-05-28
Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation software, as semiconductor and industrial customers adopt more complex AI-driven engineering workflows.
2026-05-28
digitimes.com
2026-05-28
SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give major customers influence over its fabs or equipment.
2026-05-28
digitimes.com
2026-05-28
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performan
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
digitimes.com
2026-05-28
Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial intelligence (AI) server and semiconductor supply chain companies attending and posing for group photos.
2026-05-28
www.cnbc.com
2026-05-28
CNBC
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