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Marvell expands silicon photonics, switching, and interconnect roadmap

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digitimes.com 2026-05-28

Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that AI infrastructure is shifting from compute-centric bottlenecks toward networking-driven architectures. The company's expanded interconnect portfolio, new silicon photonics acquisition, and emerging scale-up switch progr

Marvell raises multi-year outlook as AI data center demand drives accelerating growth

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digitimes.com 2026-05-28

On May 27, Marvell Technology reported record revenue in the fiscal first quarter of 2027 and raised its long-term outlook, citing accelerating demand for AI-related data center infrastructure, particularly in high-speed interconnect, Ethernet switching, and custom silicon solutions used in hyperscale cloud deployments.

Marvell AI data center Semiconductor industry Revenue growth Technology outlook High-speed interconnect Ethernet switching Data center infrastructure

Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way

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digitimes.com 2026-05-27

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.

China-based SmartSens, Unisoc team up on Micro LED optical interconnects for AI clusters

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digitimes.com 2026-05-27

SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to

Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way - digitimes

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www.digitimes.com 2026-05-27 digitimes

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design. Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site.

Huawei Tau Law Advanced packaging 3D stacking Optical interconnects System-level architecture Semiconductor industry China semiconductor EDA tools

GPU-HBM Packaging Welcomes New Fiber Interconnection Solution. "Optical-In Copper-Out" Accelerates, Optical Communication Sector Leads Gains in Early Trading. - TradingKey

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www.tradingkey.com 2026-05-26 TradingKey

Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic

GPU HBM Fiber Optic Interconnect 2.5D Packaging AI Workloads Optical Communication Semiconductor Packaging Silicon Photonics

Lightmatter joins TSMC on COUPE for 3D optical engines

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digitimes.com 2026-05-26

AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.

LED maker Ennostar pivots to optical interconnects after high-value shift agin traction

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digitimes.com 2026-05-26

Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performa

HBM-connected GPUs shifting toward optical interconnects - 富途牛牛

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news.futunn.com 2026-05-25 富途牛牛

As artificial intelligence workloads continue to expand, demand for memory capacity and bandwidth is growing rapidly, pushing existing GPU-HBM architectures toward their limits. According to ZDNet, researchers at a major South Korean memory manufacturer stated that memory and packaging companies are exploring a new approach that places the GPU and HBM in separate packages. Unlike traditional desig

GPU HBM Optical Interconnect Artificial Intelligence Semiconductor Packaging Memory Bandwidth 3D Packaging Optical Communication

Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance

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digitimes.com 2026-05-25

As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.

NVIDIA and AMD have made consecutive purchases, prompting investment banks to raise their target price! AI chip and optical interconnect leader Marvell Technology (MRVL.US) could ignite another AI rally with its upcoming earnings report. - 富途牛牛

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news.futunn.com 2026-05-22 富途牛牛

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Imec’s Patrick Vandenameele: Full-stack Innovation Is the Name of the Game

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eetimes.com 2026-05-19 Pat Brans

As AI pushes semiconductors toward new limits in energy, memory, and interconnects, imec’s CEO says future progress will depend on deep co-optimization across the entire computing stack.

Semiconductor Innovation AI Chips Silicon Photonics Chip Stacking Computing Architecture Memory Technology Interconnect Technology Quantum Computing

Interconnect Selection Challenges for AI and Chiplet-Based Designs in 2026 - News and Statistics - IndexBox

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www.indexbox.io 2026-05-18 IndexBox

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Confusion Grows With More Interconnect Options And Tradeoffs

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semiengineering.com 2026-05-18 Liz Allan

Each standard serves a specific use case, so chip architects are choosing more than one...

interconnect technology chip-to-chip communication AI system architecture chip packaging system-level design high-speed data transfer interface protocols chiplet interconnect

Semiconductor Interconnect Delays Dominate at Sub-2nm: New Challenges and Solutions - News and Statistics - IndexBox

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www.indexbox.io 2026-05-16 IndexBox

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Rising EV and AI Loads Bring Connectors Into Early Design Decisions

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eetimes.com 2026-05-12 Yashasvini Razdan

Explore how advanced interconnect solutions drive EV and AI infrastructure growth in this interview with Amphenol.

Electric Vehicles Artificial Intelligence Connectors Semiconductor Data Centers Power Management Automotive Electronics Industrial Systems

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