851 articles
2026-05-14
finance.yahoo.com 2026-05-14 Yahoo Finance
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2026-05-14
www.tradingview.com 2026-05-14 TradingView
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2026-05-14
www.mitrade.com 2026-05-14 Mitrade
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2026-05-14
www.tipranks.com 2026-05-14 TipRanks
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2026-05-14
www.gurufocus.com 2026-05-14 GuruFocus
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2026-05-14
news.google.com 2026-05-14 The Washington Post
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2026-05-14
digitimes.com 2026-05-14
While the global semiconductor industry remains fixated on 3nm, 2nm, and the AI GPU arms race, SMIC founder and "China's semiconductor godfather" Zhang Rujing is pushing a sharply different message: the future of China's chip industry may depend less on chasing the world's most advanced nodes and more on dominating the vast market still built on mature processes.
2026-05-14
digitimes.com 2026-05-14
Tower Semiconductor reported a strong start to 2026, marked by double-digit revenue growth and a significant jump in net profit. Following a "solid" first quarter, the company issued guidance for the second quarter that would represent the highest revenue in its history. Management highlighted surging growth in silicon photonics and a strategic restructuring of manufacturing in Japan as key driver
2026-05-14
digitimes.com 2026-05-14
Japan is broadening its semiconductor support strategy by expanding subsidies for domestic production of legacy chips, aiming to strengthen economic security and reduce reliance on overseas suppliers.
2026-05-14
www.fool.com 2026-05-14 The Motley Fool
Micron(MU5.81%)has recently ripped off the type of rally that few stocks will ever replicate. Since dipping to a three-month low around April 1, the stock has gained a jaw-dropping 116% in just a month and a half. After a quick return like that, investors are likely wondering if it's worth hanging around for more, if they should take their quick double and run to the bank, or if they should add to
2026-05-14
www.newelectronics.co.uk 2026-05-14 New Electronics
The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac
2026-05-14
www.foreignpolicyjournal.com 2026-05-14 foreignpolicyjournal.com
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2026-05-14
www.kjzz.org 2026-05-14 KJZZ
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2026-05-14
www.seattletimes.com 2026-05-14 The Seattle Times
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2026-05-14
www.bizjournals.com 2026-05-14 The Business Journals
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2026-05-14
www.wsj.com 2026-05-14 WSJ
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2026-05-14
www.investors.com 2026-05-14 Investor's Business Daily
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2026-05-14
finance.yahoo.com 2026-05-14 Yahoo Finance
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2026-05-14
247wallst.com 2026-05-14 24/7 Wall St.
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2026-05-14
finance.yahoo.com 2026-05-14 Yahoo Finance
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