851 articles
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-13
digitimes.com
2026-05-13
Intel's reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker gains momentum with major technology customers and leans on Washington's support to revive its foundry business.
2026-05-13
digitimes.com
2026-05-13
Ajinomoto has informed IC substrate makers that it will raise prices for its key ABF build-up film by 30%, with the new pricing expected to take effect in the third quarter of 2026. Taiwanese package substrate makers confirmed they have received the official notice, as cost pressure in the IC substrate supply chain remains elevated.
2026-05-13
news.bloomberglaw.com
2026-05-13
Bloomberg Law News
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2026-05-13
www.msn.com
2026-05-13
MSN
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2026-05-13
ca.investing.com
2026-05-13
Investing.com Canada
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2026-05-13
www.investors.com
2026-05-13
Investor's Business Daily
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2026-05-13
www.kjzz.org
2026-05-13
KJZZ
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2026-05-13
www.fool.com
2026-05-13
The Motley Fool
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2026-05-13
www.fastcompany.com
2026-05-13
Fast Company
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2026-05-13
finance.yahoo.com
2026-05-13
Yahoo Finance
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2026-05-13
www.insidermonkey.com
2026-05-13
Insider Monkey
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2026-05-13
www.tikr.com
2026-05-13
TIKR.com
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2026-05-13
247wallst.com
2026-05-13
24/7 Wall St.
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2026-05-13
www.zacks.com
2026-05-13
Zacks Investment Research
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2026-05-13
pulse2.com
2026-05-13
Pulse 2.0
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2026-05-13
www.wsj.com
2026-05-13
WSJ
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2026-05-12
semiengineering.com
2026-05-12
Semiconductor Engineering
A new technical paper, “CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation,” was published by researchers at Seoul National University, Sungkyunkwan University, Hanyang University, Sogang University, and SK Hynix.Abstract“Recent progress in generative modeling has intensified the need for compact, energy-efficient hardware
2026-05-12
tomshardware.com
2026-05-12
Etiido Uko
Chinese firms control over 70% of the global cellular module market, making any potential FCC restrictions a major supply chain threat to connected electronics.
2026-05-12
www.bizjournals.com
2026-05-12
The Business Journals
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