Semiconductor News & Analysis Feed
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2026-06-10
www.indexbox.io
2026-06-10
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2026-06-10
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2026-06-10
Eagle-Tribune
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2026-06-10
WSJ
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2026-06-10
IndexBox
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2026-06-10
www.mk.co.kr
2026-06-10
매일경제
사진 확대
"We’ll cover the investment costs, so please secure the substrate supply first."
Competition to secure supply chains in the artificial intelligence (AI) semiconductor market is entering a new phase. Just one or two years ago, High Bandwidth Memory (HBM) was the hardest component to obtain. Concerns then shifted to shortages of general-purpose DRAM and NAND flash memory, and now semiconducto
2026-06-10
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2026-06-10
MarketBeat
2026-06-10
ts2.tech
2026-06-10
TechStock²
10 JUNE 2026
AMS:ASML·SEMICONDUCTORS·STOCK MARKET
2 MINS READ
ASML SHARES DIP AFTER TERAFAB HYPE FACES EUV SHIPPING HURDLE
BY ROMAN PERKOWSKI
AMSTERDAM, June 10, 2026, 10:19 CEST
ASML shares slipped a bit on Euronext Amsterdam. The stock had jumped earlier this week with the AI rally.
Investors are watching Elon Musk’s Terafab tie-up to see if it drives real ASML tool demand.
ASML’s Q2 numbers
2026-06-10
simplywall.st
2026-06-10
simplywall.st
United States/Semiconductors/NasdaqGS:NVDA
NVIDIA (NVDA) Is Down 6.6% After New Korea‑Led AI Factory Alliances and Platform Launches
June 10, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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NVIDIA recently announced a wave of alliances in South Korea and beyond, including multi‑year deals with SK hynix, SK Telecom, NAVER and LG, alongside the rollout of its Vera Rubin and DSX platf
2026-06-10
www.moomoo.com
2026-06-10
Moomoo
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智通财经APP获悉，光大证券发布研报称，玻璃基板凭借其优异特性，逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点，且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建
2026-06-10
www.marketbeat.com
2026-06-10
MarketBeat
Erste Asset Management GmbH Has $2.24 Million Position in Cadence Design Systems, Inc. $CDNS
Written by MarketBeat
June 10, 2026
Image from MarketBeat Media, LLC.
KEY POINTS
Erste Asset Management GmbH cut its Cadence Design Systems stake by 59.1% in the fourth quarter, selling 10,196 shares and leaving it with 7,052 shares valued at about $2.24 million.
Insiders have been selling shares as well.
2026-06-10
seekingalpha.com
2026-06-10
Seeking Alpha
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2026-06-10
seekingalpha.com
2026-06-10
Seeking Alpha
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2026-06-10
www.fool.com
2026-06-10
The Motley Fool
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2026-06-10
news.google.com
2026-06-10
MarketBeat
2026-06-10
vir.com.vn
2026-06-10
Vietnam Investment Review - VIR
HANOI, VIETNAM - Media OutReach Newswire – 9 June 2026 – VinRobotics, Vingroup's pioneering robotics company, today announced the signing of a Memorandum of Understanding (MoU) with Infineon Technologies AG, a global semiconductor leader in power systems and IoT, to explore collaboration opportunities in building next-generation robotics applications based on advanced semiconductor technology. The
2026-06-10
www.semiconductor-today.com
2026-06-10
Semiconductor Today
ROHM has developed the TSC3PAK (14.00mm x 18.58mm x 3.50mm) package for silicon carbide (SiC) MOSFETs. Mass production began in June.
Picture: ROHM’s new top-side-cooling package for SiC MOSFETs.
By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performa
2026-06-10
technode.global
2026-06-10
TNGlobal
Malaysia-based fabless custom chip design company GreatAsic has raised $6.9 million in a Pre-Series A round led by Vertex Ventures Southeast Asia & India, with participation from Ehsan Kapital and Gobi Partners.
In a statement on Tuesday, Vertex Ventures said the investment is in line with Malaysia developing front-end chip design capabilities beyond its traditional role in semiconductor assembly