298 articles
2026-05-13
tomshardware.com 2026-05-13 Hassam Nasir
Ryzen PRO series gets a major upgrade.
2026-05-13
www.ad-hoc-news.de 2026-05-13 AD HOC NEWS
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2026-05-13
tomshardware.com 2026-05-13 Jowi Morales
Is going under the ice a safer alternative than going through unstable regions?
2026-05-13
tomshardware.com 2026-05-13 Kunal Khullar
Intel has officially confirmed its partnership with Googlebook as Google prepares a new lineup of Gemini-powered AI laptops.
2026-05-13
www.reuters.com 2026-05-13 Reuters
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2026-05-13
simplywall.st 2026-05-13 simplywall.st
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2026-05-13
digitimes.com 2026-05-13
Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process equipment, with the company saying demand tied to co-packaged optics started to convert into orders. The firm posted net profit after tax of NT$415 million, up 82.1% year on year, and first-quarter revenue rose 81.9%
2026-05-13
digitimes.com 2026-05-13
April results from Taiwan's power electronics sector underscored how deeply artificial intelligence infrastructure is reshaping demand for energy systems, with strong growth across data center power management, backup batteries, and advanced cooling solutions.
2026-05-13
digitimes.com 2026-05-13
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production of networking chips for SpaceX.
2026-05-13
digitimes.com 2026-05-13
Samsung Electronics' foundry business is showing signs of recovery after a prolonged downturn, as AI chip projects and HBM4-related demand begin to raise utilization at its advanced-process lines.
2026-05-13
digitimes.com 2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-13
stockstory.org 2026-05-13 StockStory
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2026-05-13
www.tradingview.com 2026-05-13 TradingView
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2026-05-13
news.google.com 2026-05-13 NVIDIA Developer
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2026-05-13
www.deccanherald.com 2026-05-13 Deccan Herald
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2026-05-13
news.google.com 2026-05-13 Phoronix
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2026-05-13
www.tradingview.com 2026-05-13 TradingView
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2026-05-12
www.newswise.com 2026-05-12 Newswise
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2026-05-12
pulse2.com 2026-05-12 Pulse 2.0
Indie Semiconductor has announced a definitive agreement to acquire the fabless CMOS image sensor group from ams OSRAM AG for total consideration of €40 million, comprising a €35 million cash payment at closing and a €5 million vendor-debt note issued by ams OSRAM. The transaction is expected to close in the third quarter of 2026, subject to customary closing conditions, including regulatory appro
2026-05-12
finance.yahoo.com 2026-05-12 Yahoo Finance
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