Semiconductor News & Analysis Feed
16 articles
2026-06-09
www.trendforce.com
2026-06-09
TrendForce
[News] Samsung, NVIDIA Deepen Ties as Talks Reportedly Expand to HBM5 Next Year and Next-Gen Groq Chips
2026-06-09 Semiconductors editor
News
Please note that this article cites information from The Chosun Daily, Seoul Economic Daily, ZDNet, Yonhap News, Newspim, and Dealsite.
Following Jensen Huang’s high-profile meetings with SK hynix during his South Korea visit, Samsung Electronics V
2026-06-09
digitimes.com
2026-06-09
Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue to expand. The comment was made by Samsung Electronics co-CEO and head of the Device Solutions (DS) division Young-hyun Jun following talks with Nvidia CEO Jensen Huang and senior executives at The Shilla hotel in Jun
2026-06-08
www.digitimes.com
2026-06-08
digitimes
Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style packaging, higher memory bandwidth, and GPU-based AI acceleration to...
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2026-06-08
digitimes.com
2026-06-08
Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style packaging, higher memory bandwidth, and GPU-based AI acceleration to strengthen on-device computing while reshaping how premium PCs approach local AI workloads.
2026-06-06
hothardware.com
2026-06-06
HotHardware
NVIDIA RTX Spark vs. Apple M5 Pro: The Unified Architecture Battle
by Zak Killian — Saturday, June 06, 2026, 11:05 AM EDT
Comments
Announced earlier this week at Computex, NVIDIA's RTX Spark has finally been revealed after what seems like years of leaks and rumors concerning the "N1/N1X". These chips are the consumer versions of the GB10 Superchip found in the NVIDIA DGX Spark that was released
2026-06-05
tomshardware.com
2026-06-05
Matt Safford
Wokyis is already selling its M5 dock that turns your Mac Mini into a mini Macintosh. But it plans to add G7 NES-themed docks, as well, with up to 80Gbps of throughput and larger 7-inch screens.
2026-06-03
tomshardware.com
2026-06-03
Luke James
Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
2026-06-02
biz.chosun.com
2026-06-02
Chosunbiz
By
Choi Hyo-jung
Published 2026.06.02. 18:07
Updated 2026.06.03. 00:39
Samsung Electronics and SK hynix moved to compete for leadership over high-bandwidth memory (HBM), which has emerged as a core component in the age of artificial intelligence (AI), at Computex 2026, Asia's largest IT and computing trade show, in Taipei, Taiwan. Samsung Electronics highlighted its technological competitiveness
2026-06-02
www.asiae.co.kr
2026-06-02
아시아경제
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2026-06-02
tomshardware.com
2026-06-02
Aaron Klotz
Noctua has entered the thermal pad market in partnership with thermal pad maker Carbice, featuring the new NT-CP1 designed for AM5 and AM4 Ryzen CPUs.
2026-06-01
tomshardware.com
2026-06-01
Jake Roach
AMD confirmed it will support its current AM5 socket through 2029, extending the timeline by two years and likely lining up at least two more generations on the socket.
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:27 AM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:27 AM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring
2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
www.trendforce.com
2026-05-26
TrendForce
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2026-05-26
biz.chosun.com
2026-05-26
Chosunbiz
By
Hwang Min-gyu
Published 2026.05.26. 09:13
A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix
SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package.
On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC