Semiconductor News & Analysis Feed

NIST has demonstrated a metal 3D printing method that stirs molten metal during the print by sending the laser along looping elliptical paths instead of straight lines.

Hynixs, Nasdaq SK Hynix's Nasdaq Countdown: HBM Heat, Tighter Credit, and a Smoldering Campus 13.06.2026 - 19:45:25 | boerse-global.de SK Hynix fire at Cheongju campus doesn't dent stock; ADR listing planned amid HBM boom, supply chain pressure, and rising swap costs. Hynixs - SK Hynix's Nasdaq Countdown: HBM Heat, Tighter Credit, and a Smoldering Campus 13.06.2026 - Bild: über boerse-global.de

As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl

Besides Samsung Heavy, Japan’s MOL is also building a 73 MW floating data center with Karpowership for a 2027 deployment.

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