SemiPulse — Semiconductor Intelligence

AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.

Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC

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digitimes.com 2026-05-22

Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at expanding Samsung's foundry business by securing another major customer after deals with Tesla and renewed work with AMD. Samsung declined to comment, and MediaTek had not issued an official response by press time.

AMD deepens Taiwan supply chain ties with US$10B-plus push

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digitimes.com 2026-05-22

AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan's industrial ecosystem to accelera

WPG Holdings flags server supply gaps amid memory price hikes, 800V shift

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digitimes.com 2026-05-22

Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.

Nvidia characterizes LPX as niche silicon optimized for high-speed premium tokens

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digitimes.com 2026-05-22

Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market

AI memory crunch pushes Nanya Technology toward 2027 fab ramp

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digitimes.com 2026-05-22

Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the DRAM maker will accelerate new fab construction to capture AI-led memory demand. Equipment installation is scheduled to begin in the first quarter of 2027, followed by mass production in the second half.

AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26

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digitimes.com 2026-05-22

Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced

Samsung's GaN setback puts foundry shift in focus

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digitimes.com 2026-05-22

Samsung Electronics is reportedly preparing to shift more of its gallium nitride (GaN) power semiconductor strategy toward foundry services after struggling to secure customers for its own GaN devices and modules, according to The Elec.

AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

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digitimes.com 2026-05-22

AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on anelevated fanout bridge(EFB)packaging ecosystem.

Analysis: Samsung deal prevents walkout but deepens internal rifts over compensation

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digitimes.com 2026-05-22

Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion (approx. US$66.8 billion) in supply chain disruption. The deal eases an immediate labor crisis but leaves unresolved structural conflicts and rising personnel costs.

Forcelead Technology bets on stable 2026 as it expands into TDDI and new automotive displays

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digitimes.com 2026-05-22

Forcelead Technology said it expects stable operations through 2026 as it rolls out a touch-TDDI product and pursues new automotive display opportunities, a development with implications for global suppliers and aftermarket channels as automakers adopt more advanced cockpit features. The company aims to protect margins while expanding beyond its core display business.

Watch Micron CEO Sees Memory Chip Shortage Lasting Beyond 2026 - Bloomberg.com

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www.bloomberg.com 2026-05-22 Bloomberg.com

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BOE, Corning target glass substrates for AI chip packaging

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digitimes.com 2026-05-22

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.