Semiconductor News & Analysis Feed
791 articles
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
www.fool.com
2026-05-27
The Motley Fool
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2026-05-27
simplywall.st
2026-05-27
simplywall.st
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2026-05-27
tomshardware.com
2026-05-27
Jowi Morales
Some Chinese AI industry leaders must get the green light from Beijing before they can take that international vacation.
2026-05-27
stockstory.org
2026-05-27
StockStory
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2026-05-26
www.tradingkey.com
2026-05-26
TradingKey
Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic
2026-05-26
seekingalpha.com
2026-05-26
Seeking Alpha
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2026-05-26
seekingalpha.com
2026-05-26
Seeking Alpha
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2026-05-26
seekingalpha.com
2026-05-26
Seeking Alpha
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2026-05-26
seekingalpha.com
2026-05-26
Seeking Alpha
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2026-05-26
seekingalpha.com
2026-05-26
Seeking Alpha
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.zacks.com
2026-05-26
Zacks Investment Research
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com
2026-05-26
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20 weeks. As a result, some orders that once went to major Japanese and South Korean suppliers are gradually spilling over to Taiwan-based makers.
2026-05-26
digitimes.com
2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-26
digitimes.com
2026-05-26
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of WIN Semiconductors, said the company is actively advancing a range of products, including driver ICs, continuous-wave (CW) lasers, and photodiodes, while also ramping up capacity in anticipation of growing demand from next-generation networks.
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly t
2026-05-26
ca.finance.yahoo.com
2026-05-26
Yahoo! Finance Canada
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