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2026-05-20
Malaysian Chip Design Firm SkyeChip Surges in Trading Debut - marketscreener.com
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www.marketscreener.com 2026-05-20 marketscreener.com
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2026-05-20
SkyeChip soars in IPO at open as Malaysia bets on chip design - Nikkei Asia
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asia.nikkei.com 2026-05-20 Nikkei Asia
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2026-05-19
How Malaysia’s Semiconductor Industry Can Thrive in an Era of Strategic Competition - The Diplomat – Asia-Pacific Current Affairs Magazine
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thediplomat.com 2026-05-19 The Diplomat – Asia-Pacific Current Affairs Magazine
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2026-05-14
Chip design firm listings fuel Malaysia IPO market surge - Communications Today
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www.communicationstoday.co.in 2026-05-14 Communications Today
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2026-05-11
Malaysia pushes regional chip design ambitions - Vietnam+ (VietnamPlus)
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en.vietnamplus.vn 2026-05-11 Vietnam+ (VietnamPlus)
Vietnam+ (VietnamPlus)Copyright, VietnamPlus, Vietnam News Agency (VNA)Editor-in-chief, Mr. Tran Tien Duan.
semiconductor industrySoutheast Asia chipsMalaysia technologychip designregional cooperationVietnam economytechnology developmentmanufacturing upgrade
2026-05-11
NEWS: Three chip design firms get access to Arm's tokens - The Edge Malaysia
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theedgemalaysia.com 2026-05-11 The Edge Malaysia
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2026-05-11
Malaysia eyes 7 percent global advanced packaging share by 2035 - TNGlobal
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technode.global 2026-05-11 TNGlobal
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2026-05-11
Putrajaya backs three local firms to lead Made-in-Malaysia chip design drive under Arm partnership - The Vibes
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www.thevibes.com 2026-05-11 The Vibes
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2026-05-08
Malaysia to develop advanced semiconductor packaging capability in 2 years - Free Malaysia Today
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www.freemalaysiatoday.com 2026-05-08 Free Malaysia Today
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2026-05-08
Govt bets on five local semiconductor companies to capture 7% of the global advanced packaging market by 2035 - The Edge Malaysia
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theedgemalaysia.com 2026-05-08 The Edge Malaysia
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2026-05-08
Govt bets on five local semiconductor companies to capture 7% of the global advanced packaging market by 2035 - The Edge Malaysia
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theedgemalaysia.com 2026-05-08 The Edge Malaysia
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2026-05-08
MOSTI pushes Malaysia towards high-value semiconductor future with advanced packaging drive - The Vibes
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www.thevibes.com 2026-05-08 The Vibes
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2026-05-08
Malaysia's local semiconductor players are making their advanced packaging move, and the stakes could not be higher - CRN Asia
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www.crnasia.com 2026-05-08 CRN Asia
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2026-05-07
Malaysia wants 7% of the global advanced packaging market by 2035. Right now, it has zero. - Tech Wire Asia
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techwireasia.com 2026-05-07 Tech Wire Asia
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2026-05-07
The opportunity clock is ticking for Malaysia’s advanced packaging - Tech Wire Asia
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techwireasia.com 2026-05-07 Tech Wire Asia
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2026-05-06
Malaysia has 32 ARM chip design licenses. Here is what the government is actually doing with them. - CRN Asia
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www.crnasia.com 2026-05-06 CRN Asia
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