Semiconductor News & Analysis Feed
1461 articles
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
Micron jumps 16% after UBS triples price target to $1,625 on AI memory demand
UBS analyst Timothy Arcuri tripled his Micron price target, citing long-term supply agreements and AI-driven demand for hi
2026-05-27
sourceability.com
2026-05-27
Sourceability
The semiconductor industry’s dependence on a handful of manufacturers confined to only a few countries has been a known vulnerability for years. Samsung’s labor negotiations in South Korea illustrate the risks tied to both concentrated geopolitical sources and the growing demands on the ever-shrinking chip workforce.
Meanwhile, ASML’s partnership with Tata Electronics signals growing momentum b
2026-05-27
247wallst.com
2026-05-27
24/7 Wall St.
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2026-05-26
www.reuters.com
2026-05-26
Reuters
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
247wallst.com
2026-05-26
24/7 Wall St.
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
sherwood.news
2026-05-26
Sherwood News
Luke Kawa
12M
Micron soars as UBS more than triples price target to $1,625, predicting a near $2 trillion memory juggernaut
It’s different this time.
That’s the call from UBS analyst Timothy Arcuri, who more than tripled his price target on memory specialist MicronMU $815.46 (-1.48%) to $1,625 from $535. If his view were realized, the company would be worth north of $1.8 trillion.
Shares are su
2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
seekingalpha.com
2026-05-26
Seeking Alpha
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2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
www.blocksandfiles.com
2026-05-26
Blocks & Files
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2026-05-26
www.investing.com
2026-05-26
Investing.com
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2026-05-26
ca.investing.com
2026-05-26
Investing.com Canada
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2026-05-26
overclock3d.net
2026-05-26
OC3D
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2026-05-26
www.awazthevoice.in
2026-05-26
Awaz The Voice
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2026-05-26
www.chosun.com
2026-05-26
조선일보
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2026-05-26
vir.com.vn
2026-05-26
Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize