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2026-05-28
Swapping Out Chiplets: I/Os Vs. Compute
0.92
semiengineering.com 2026-05-28 Liz Allan
Multi-die assemblies give chip architects the option to change some dies while keeping ...
ChipletsCompute dieI/O dieProcess node3nm technology224G SerDesLPDDR6LPDDR5X
2026-05-14
Chiplets Need A New Workflow
0.92
semiengineering.com 2026-05-14 Ann Mutschler
Multi-die assemblies are facing full system-level challenges, but engineering teams nee...
ChipletsSystem-level designAdvanced packagingMulti-physics simulationAI in chip designReliability engineeringDesign flow2.5D/3D architecture
2026-05-12
AI Accelerator Testing Depends On DFT Innovations
0.92
semiengineering.com 2026-05-12 Laura Peters
Multi-die assemblies greatly increase the number of things that can go wrong, and the d...
AI AcceleratorSemiconductor TestingDFT InnovationChip TestingSystem-Level TestingMulti-Chip Module2.5D Packaging3D Packaging