Semiconductor News & Analysis Feed
7 articles
2026-06-21
wccftech.com
2026-06-21
Wccftech
Samsung has proven that it can develop cutting-edge lithography, with its upcoming Exynos 2700 serving as an excellent example, as the company has been reported to be progressing well with its next flagship SoC. However, as far as its 2nm GAA process goes, a rumor states that when comparing Power, Performance, and Area (PPA) metrics, TSMC’s 2nm N2P is ahead in the race. This may explain why, along
2026-06-19
wccftech.com
2026-06-19
Wccftech
The slightly advanced 2nm ‘N2P’ process from TSMC is reportedly being used by Qualcomm and MediaTek, with both companies aiming to gain an advantage over Apple later this year. However, the Cupertino firm is expected to match its rivals’ competitiveness by adopting the same manufacturing process next year for the A21 Pro, but only the latter will receive preferential treatment for the improved tec
2026-06-19
wccftech.com
2026-06-19
Wccftech
MOBILE
RUMOR
SEMICONDUCTOR
Apple’s A21 Pro May Exclusively Use TSMC’s Improved 2nm ‘N2P’ Process While Keeping The Standard Version On The Older Node
Omar Sohail
•
Jun 19, 2026 at 03:06am EDT
Add Wccftech on Google
Comments
The slightly advanced 2nm ‘N2P’ process from TSMC is reportedly being used by Qualcomm and MediaTek, with both companies aiming to gain an advantage over Apple later this year
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
Edited
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks
Features
By Anton Shilov published 4 hours ago
TSMC kicks off unprecedented capacity expansion plan.
(Image credit: Getty Images / Jimmy Beunardeau)
Share
Share this article
Join the conversation
Follow us
Add us as a preferred source on Google
Newslette
2026-06-08
finance.yahoo.com
2026-06-08
Yahoo Finance
Silvaco (SVCO) Launches Industry-First MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
Maham Fatima
Mon, June 8, 2026 at 4:25 AM AST 2 min read
SVCO
-13.61%
TSM
-6.69%
Silvaco Group Inc. (NASDAQ:SVCO) is one of the hot tech stocks to buy according to analysts. On May 19, Silvaco announced the immediate availability of its Mixel MIPI C-PHY/D-PHY Combo Universal IP on TSMC’s N2P process. This new sol
2026-06-04
www.theverge.com
2026-06-04
The Verge
TECH
NEWS
MICROSOFT
Nvidia is already planning N2X and N3X chips — the goal is the Star Trek computer
“It’s like Scotty talking to that mouse,” says Nvidia’s CEO.
by
Sean Hollister
Jun 4, 2026, 4:03 AM GMT+8
18
18
Comments (All New)
Jensen Huang, chief executive officer of Nvidia Corp. Bloomberg via Getty Images
Part Of
Computex 2026: All the news and announcements
SEE ALL UPDATES
Sean Holliste