Semiconductor News & Analysis Feed

7 articles
2026-06-21
wccftech.com 2026-06-21 Wccftech
Samsung has proven that it can develop cutting-edge lithography, with its upcoming Exynos 2700 serving as an excellent example, as the company has been reported to be progressing well with its next flagship SoC. However, as far as its 2nm GAA process goes, a rumor states that when comparing Power, Performance, and Area (PPA) metrics, TSMC’s 2nm N2P is ahead in the race. This may explain why, along
2026-06-19
wccftech.com 2026-06-19 Wccftech
The slightly advanced 2nm ‘N2P’ process from TSMC is reportedly being used by Qualcomm and MediaTek, with both companies aiming to gain an advantage over Apple later this year. However, the Cupertino firm is expected to match its rivals’ competitiveness by adopting the same manufacturing process next year for the A21 Pro, but only the latter will receive preferential treatment for the improved tec
2026-06-19
wccftech.com 2026-06-19 Wccftech
MOBILE RUMOR SEMICONDUCTOR Apple’s A21 Pro May Exclusively Use TSMC’s Improved 2nm ‘N2P’ Process While Keeping The Standard Version On The Older Node Omar Sohail • Jun 19, 2026 at 03:06am EDT Add Wccftech on Google Comments The slightly advanced 2nm ‘N2P’ process from TSMC is reportedly being used by Qualcomm and MediaTek, with both companies aiming to gain an advantage over Apple later this year
2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
Suess Microtec, DE000A1K0235 New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand 16.06.2026 - 05:05:28 | ad-hoc-news.de Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools. Suess Microtec, DE000A1K0235 Edited
2026-06-10
www.tomshardware.com 2026-06-10 Tom's Hardware
Tech Industry Manufacturing Semiconductors Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks Features By Anton Shilov published 4 hours ago TSMC kicks off unprecedented capacity expansion plan. (Image credit: Getty Images / Jimmy Beunardeau) Share Share this article Join the conversation Follow us Add us as a preferred source on Google Newslette
2026-06-08
finance.yahoo.com 2026-06-08 Yahoo Finance
Silvaco (SVCO) Launches Industry-First MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process Maham Fatima Mon, June 8, 2026 at 4:25 AM AST 2 min read SVCO -13.61% TSM -6.69% Silvaco Group Inc. (NASDAQ:SVCO) is one of the hot tech stocks to buy according to analysts. On May 19, Silvaco announced the immediate availability of its Mixel MIPI C-PHY/D-PHY Combo Universal IP on TSMC’s N2P process. This new sol
2026-06-04
www.theverge.com 2026-06-04 The Verge
TECH NEWS MICROSOFT Nvidia is already planning N2X and N3X chips — the goal is the Star Trek computer “It’s like Scotty talking to that mouse,” says Nvidia’s CEO. by Sean Hollister Jun 4, 2026, 4:03 AM GMT+8 18 18 Comments (All New) Jensen Huang, chief executive officer of Nvidia Corp. Bloomberg via Getty Images Part Of Computex 2026: All the news and announcements SEE ALL UPDATES Sean Holliste