Semiconductor News & Analysis Feed

Recent teardown analysis by SemiAnalysis of Huawei's Kirin 9030 chip revealed that SMIC's third-generation 7nm process (N+3) achieves a smaller metal pitch than Intel's 18A and surpasses TSMC's N6 in transistor density, despite not using EUV lithography. However, this does not make SMIC's N+3 proces

Xiaomi's upcoming 18 series smartphone lineup is set to debut with Qualcomm's first 2nm chip, the Snapdragon 8 Elite Gen6. This marks a significant advancement in mobile processor technology, with the chip featuring a split standard and Pro variant strategy to manage rising manufacturing and memory

STMicroelectronics has introduced the MASTERGAN6 and MASTERGAN7, two new gallium nitride (GaN) power devices designed to accelerate GaN adoption across various applications. These devices integrate low-dropout regulators (LDOs) for both high-side and low-side drivers, eliminating the need for extern