Semiconductor News & Analysis Feed
4765 articles
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that
2026-06-16
tomshardware.com
2026-06-16
Zhiye Liu
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
2026-06-16
digitimes.com
2026-06-16
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that was just Apple's messaging. Most on-device AI features only need 8GB of memory; only the Apple-defined advanced on-device AI requires the higher 12GB spec.
2026-06-16
digitimes.com
2026-06-16
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
digitimes.com
2026-06-16
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world's first 8nm-class MRAM at an international conference.
2026-06-16
digitimes.com
2026-06-16
Shanghai Enflame Technology is nearing a STAR Market listing, bringing another Chinese AI chipmaker closer to public markets while losses, Tencent concentration, and a small share in Nvidia-led accelerators remain unresolved.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according to a report by the Seoul Economic Daily.
2026-06-16
digitimes.com
2026-06-16
AI, high-performance computing, and early pull-ins from TV, PC, and notebook supply chains pushed the global foundry market to a record high in the first quarter of 2026. China's Nexchip Semiconductor delivered the key ranking shift, overtaking Taiwan's Vanguard International Semiconductor (VIS) for the first time to become the world's eighth-largest foundry.
2026-06-16
digitimes.com
2026-06-16
NAND flash memory supplier Kioxia Holdings has surpassed Toyota Motor in market capitalisation, becoming Japan's most valuable company. The development highlights how the global artificial intelligence (AI) boom is reshaping Japan's corporate landscape.