Semiconductor News & Analysis Feed
42 articles
2026-06-18
digitimes.com
2026-06-18
Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.
2026-06-16
news.google.com
2026-06-16
Manistee News Advocate
2026-06-14
tomshardware.com
2026-06-14
Luke James
NIST has demonstrated a metal 3D printing method that stirs molten metal during the print by sending the laser along looping elliptical paths instead of straight lines.
2026-06-13
www.taipeitimes.com
2026-06-13
Taipei Times
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2026-06-12
digitimes.com
2026-06-12
TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed that the US government could block imports to the US of chips made by TSMC as a result of the case, and have enlisted several members of Congress to support their position, drawing market attention.
2026-06-10
theedgemalaysia.com
2026-06-10
The Edge Malaysia
Economy Minister Akmal Nasrullah Mohd Nasir (Photo by Shahrill Basri/The Edge)
GEORGE TOWN (June 10): The Advanced Packaging Institute and Research Centre (APIRC) aims to develop 12 local small and medium enterprises (SMEs) in the advanced packaging ecosystem and attract new investments worth RM8.5 billion by 2030.
Economy Minister Akmal Nasrullah Mohd Nasir said the target would be implemented
2026-06-08
www.koreaherald.com
2026-06-08
The Korea Herald
Nvidia CEO Jensen Huang (left) speaks during the Korea AI Ecosystem Reception in Seoul on Monday, attended by Science Minister Bae Kyung-hoon. (Yonhap)
Science Minister Bae Kyung-hoon met with Nvidia Corp. Chief Executive Officer (CEO) Jensen Huang in Seoul on Monday and discussed various areas of cooperation, including ways to nurture the local physical artificial intelligence (AI) ecosystem.
T
2026-06-08
www.reuters.com
2026-06-08
Reuters
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2026-06-07
digitimes.com
2026-06-07
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus, the national semiconductor champion formed to commercialize advanced node chips, to fund plant construction, equipment and research for 2nm and 1.4nm chips. The funding was executed through the Information-Technolog
2026-06-05
tomshardware.com
2026-06-05
Etiido Uko
Risks are emerging despite billions of dollars of US investment in domestic semiconductor supply chains
2026-06-05
www.tomshardware.com
2026-06-05
Tom's Hardware
Tech Industry Artificial Intelligence
Industry coalition urges Trump administration to take urgent action as AI data centers' extreme memory consumption threatens other industries — AI-driven memory chip shortage could raise prices in automotive, medical, telecommunications sectors
News
By Etiido Uko published 2 days ago
Risks are emerging despite billions of dollars of US investment in domestic
2026-06-03
eetimes.com
2026-06-03
NSTC Minister Wu shares Taiwan's four-pillar shift from chipmaker to AI enabler.
2026-06-01
www.fool.com
2026-06-01
The Motley Fool
At a recent rally in New York, President Donald Trump spoke warmly about memory-chip maker Micron Technology (
MU
+5.07%
). He referenced the company's ambitious plans to invest an estimated $200 billion into expanding its domestic chip fabrication capacities over the next several years.
More broadly, Trump's remarks reflected his enthusiasm for onshoring U.S. manufacturing. I think this raises a
2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-27
digitimes.com
2026-05-27
Nvidia CEO Jensen Huang, who is visiting Taiwan for two weeks, stated that the island's manufacturing sector is developing rapidly and needs more electricity.
2026-05-22
www.benzinga.com
2026-05-22
Benzinga
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2026-05-21
www.tradingview.com
2026-05-21
TradingView
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2026-05-08
www.reuters.com
2026-05-08
Reuters
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2026-05-08
news.google.com
2026-05-08
Investing.com
2026-05-08
www.semafor.com
2026-05-08
Semafor
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