Semiconductor News & Analysis Feed

Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit satellite communications customer and first equipment deliveries completed in the first half of 2026. The company said related sales could quickly rise to double digits as a share of annual revenue, with implications for supply chains worldwide.

As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain bottlenecks, with industry watchers saying the number of components that are currently in a severe shortage now far exceeds those that are not.

The U.S. Semiconductor Industry Association (SIA) has proposed harmonizing semiconductor regulations across North America. In a letter to the U.S. Trade Representative (USTR), the SIA stated that this harmonization of common standards could be addressed in the review of the United States-Mexico-Canada Agreement (USMCA). According to the Washington, D.C.-based association, semiconductors are esse

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Synopsys reported divergent regional performance in the second quarter, with China showing sequential growth while North America and Europe declined, as demand patterns for semiconductor design tools and simulation software remained uneven across end markets.

US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.

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