Semiconductor News & Analysis Feed
2027 articles
2026-06-12
www.bloomberg.com
2026-06-12
Bloomberg.com
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2026-06-12
www.bloomberg.com
2026-06-12
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2026-06-12
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2026-06-12
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2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
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CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering
PR Newswire
Thu, June 11, 2026 at 9:00 PM PDT 3 min read
HYDERABAD, India and SEBERANG PERAI, Malaysia, June 12, 2026 /PRNewswire/ -- The semiconductor industry is under growing pressure
2026-06-12
www.digitimes.com
2026-06-12
digitimes
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these...
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2026-06-12
www.businesstimes.com.sg
2026-06-12
The Business Times
Singapore announces new road map to improve standards and conformance capabilities, partnerships
Five memorandums of understanding between EnterpriseSG and its international and regional partners are formalised
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Elysia Tan
Published Fri, Jun 12, 2026 · 10:30 AM
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DPM Gan says the new road map aims to “build and deepen trust, so that assu
2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering
PR Newswire
Thu, June 11, 2026 at 6:30 PM PDT 2 min read
SEBERANG PERAI, Malaysia, June 12, 2026 /PRNewswire/ -- The semiconductor industry is under growing pressure to deliver more capa
2026-06-12
news.google.com
2026-06-12
HealthExec
2026-06-12
digitimes.com
2026-06-12
Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway from a recent panel discussion at SuperAI Singapore, which brought chip makers and an AI model accelerator together to address how to overcome inference bottlenecks at a time when compute workloads are hitting up against physical limits.
2026-06-12
digitimes.com
2026-06-12
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used by chips. After the post-pandemic inventory correction, industry players say power semiconductors have shifted "from a supporting role to the lead" under the new AI high-voltage direct current (HVDC) power architecture.
2026-06-12
digitimes.com
2026-06-12
Chinese PC major Lenovo is reportedly set to raise prices across its entire product line from July 2026, with increases broadly in line with its first round of adjustments in March. Retail prices for some models could rise by as much as CNY1,000 (approx. US$148).
2026-06-12
digitimes.com
2026-06-12
China's two leading memory chipmakers, CXMT and YMTC, are moving closer to the capital market, putting the country's memory industry back under the semiconductor spotlight.
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-12
digitimes.com
2026-06-12
As CXMT and YMTC move toward initial public offerings, other players across China's memory supply chain are also advancing expansion, fundraising, and listing plans. The activity spans memory modules, controller chips, and niche DRAM, underscoring how China's memory industry is evolving from upstream chipmakers into a broader supply chain ecosystem.
2026-06-12
digitimes.com
2026-06-12
TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed that the US government could block imports to the US of chips made by TSMC as a result of the case, and have enlisted several members of Congress to support their position, drawing market attention.
2026-06-12
digitimes.com
2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com
2026-06-12
SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August.
2026-06-12
digitimes.com
2026-06-12
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.
2026-06-12
digitimes.com
2026-06-12
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales, pressuring its May results and revenues for the first five months of the year. The company disclosed May revenue of NT$63.87 million (US$2 million), down 29.37% month-over-month, and cumulative revenue for the first
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl