Semiconductor News & Analysis Feed

SK Hynix is reportedly hiring engineers for 3D-stacked DRAM-on-Logic development, signaling a strategic move to support on-device AI applications. This advanced memory architecture integrates DRAM directly on top of system-on-chip (SoC) dies, offering shorter interconnects, higher data I/O channels,

At Unreal Fest 2026, NVIDIA unveiled the new NVIDIA ACE Game Agent SDK and Unreal Engine 5 plugins, aimed at empowering developers to build on-device AI companions. The SDK, built on a lightweight C/C++ framework, supports stateful reasoning, chat interfaces, and retrieval-augmented generation (RAG)

This technological breakthrough represents a significant advancement for the smartphone industry, offering substantial performance enhancement potential. Low Latency Wide DRAM (LLW) adopts an integrated design similar to HBM, addressing the performance bottlenecks of traditional LPDDR memory. While

Qualcomm unveiled its new Dragonwing Mobile Broadband Multimedia (MBM) silicon solution in early June 2026, marking a significant step toward AI-enabled connectivity platforms. The new MBM family integrates 5G and Wi-Fi connectivity with multimedia processing and on-device AI, targeting a broader ra

At the 2026 Qualcomm Automotive Technology and Cooperation Summit on June 5, Qualcomm unveiled the 'Claw' ecosystem plan in collaboration with partners such as ArcherMind Technology, AUTOLINK, Banma Intelligent, Desai SV, Megatronix Technology, and ThunderSoft. This initiative marks the industry's f

Qualcomm has launched its Dragonwing Mobile Broadband Multimedia (MBM) family, comprising the MBM715 and MBM415 platforms, marking a significant expansion in its broadband hardware offerings. Built on 4nm process technology, these chips integrate 5G modems, Wi-Fi 7, image signal processors, GPUs, an