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LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.

Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i

Qualcomm’s new Dragonwing MBM silicon solution combines interactive multimedia with top-tier connectivity & on-device AI June 9, 2026 | INTELLIGENT CONNECTIVITY | by Claus Hetting, Wi-Fi NOW CEO & Chairman By Claus Hetting, WiFi NOW CEO & Chairman It is not often that major chipset vendors introduce an entirely new class of AI-enabled connectivity platforms but Qualcomm did exactly that only tw

Home / News / Qualcomm Announces On-Device AI Claw Ecosystem Plan Qualcomm Qualcomm Announces On-Device AI Claw Ecosystem Plan Edited by Greg From Gasgoo | June 8 , 2026 15:00 BJT f SHARE TWEET in SHARE SHARE Gasgoo Munich- On June 5, at the 2026 Qualcomm Automotive Technology and Cooperation Summit, Qualcomm and ecosystem partners—including ArcherMind Technology, AUTOLINK, Banma Intelligent, Des

Qualcomm Brings Wi-Fi 7 and On-Device AI to Broadband Hardware The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity. NEWS 5 hours ago by Luke James Qualcomm has launched the Dragonwing Mobile Broadband Multimedia (MBM) family, a two-tier portfolio of 4-nm platforms that integrate a 5G modem, Wi-Fi, image signal pr

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