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Nan Ya PCB, one of Taiwan's leading IC substrate manufacturers, said it expects capital spending to rebound sharply in 2026, potentially reaching a record high, as demand from advanced chip packaging customers accelerates alongside the rapid growth of artificial intelligence (AI) computing.

Nan Ya PCB's push into advanced IC substrates could influence global AI hardware supply chains by increasing capacity for high-performance GPUs, switches, and edge AI devices. The company's 2026 development plans and use of parent-group factories in southern Taiwan aim to meet accelerating AI-related demand as well as higher automotive and mobile sector requirements.

The global buildout of artificial intelligence data centers is driving a new wave of demand for high-speed networking infrastructure, as the efficiency of communication between servers becomes increasingly critical.

A tech enthusiast has combined an Nvidia GeForce RTX 3070 (8GB) with defective memory and an AMD Radeon RX 6900 XT (16GB) with a damaged GPU to make a working RTX 3070 with 16GB of VRAM.

South Korean copper clad laminate (CCL) maker Doosan is reportedly moving to strengthen its overseas capacity in Thailand, a key production hub for Taiwan PCB suppliers serving global tech giants. The company has announced plans to set up a new subsidiary in Bangpu Industrial Estate and build a new CCL plant there.

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Taiwanese PCB maker Tripod Technology posted its strongest-ever first-quarter performance in 2026, driven by resilient server and memory demand tied to the global AI infrastructure buildout and spillover orders from higher-end AI server supply chains.

Flexible printed circuit board (FPCB) manufacturer Flexium Interconnect said during an earnings call on May 8 that, looking ahead, imbalances in memory market supply and demand will impact the industry. Aside from major US customers with stronger pricing power, the mass production and shipment schedules for new products such as smart glasses and artificial intelligence (AI) servers have been delay

The global copper-clad laminate market expanded sharply as AI computing demand forced higher-spec hardware, and Taiwan's printed circuit board supply chain moved to secure second-source positions, industry data showed. The Taiwan Printed Circuit Board Association reported the copper-clad laminate market reached US$16.02 billion in 2025 and was projected to rise to US$21.5 billion in 2026 as server

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant, to be located in the Kaohsiung Nanzih Technology Industrial Park, is scheduled to open in September 2029.

Another hidden gem is about to be price-hiked now.

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The PCB industry is entering a new phase of transformation in the AI era, as rising demand for high-frequency and high-speed applications accelerates upgrades in upstream copper-clad laminate (CCL) materials. Among the beneficiaries is impregnation equipment maker Asia Metal Industries (AMI).