Semiconductor News & Analysis Feed

During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic re

In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they

As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they

As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl

In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi

While marketing initiatives promote an ultra-fast transition to wide-bandgap (WBG) semiconductors, fully automated smart factories, and an all-electric automotive future, the sentiment across the PCIM Europe 2026 exhibition floor is more pragmatic. The industry has reached a transitional maturity wall where the realities of material physics, fragmented design silos, and macroeconomic supply shocks

Global hardware growth is facing an increasingly fragile and fragmented supply chain. At PCIM Europe 2026, software intelligence firm Luminovo's OEM Growth Lead, Inga Schwarz, made a compelling case for why AI is no longer enough to save hardware companies from costly operational challenges. The industry, she argued, must embrace a transition toward deep, native domain enterprise integration to bu

A 44% switching loss reduction claim puts the Si829x at the centre of the EV drivetrain efficiency conversation for 2026 and beyond June 9, 2026 Skyworks Solutions has unveiled the Si829x, an isolated gate driver for electric vehicle (EV) traction inverters, at PCIM 2026 in Nuremberg. Using ProVCD variable current drive technology, the Si829x cuts switching losses by up to 44% against voltage-mo

PCIM 2026: SemiQ to Showcase SiC Power Solutions In The News | 05-06-2026 | By Jack Pollard SemiQ Inc, a designer and global supplier of silicon carbide (SiC) solutions for high-performance and high-voltage applications, will debut its latest SiC module advancements at PCIM 2026, including an expanded QSiC™ Dual3 MOSFET family featuring high-thermal-performance options with AlN (Aluminium Nitrid

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