Semiconductor News & Analysis Feed
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2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
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2026-06-03
Yahoo Finance
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2026-06-03
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2026-06-03
Proactive financial news
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2026-06-03
thequantuminsider.com
2026-06-03
The Quantum Insider
PRESS RELEASE — Infineon Technologies AG (FSE: IFX) (OTCQX: IFNNY) today announces the integration of its OPTIGA™ Trusted Platform Module (TPM) SLB 9672 with NVIDIA’s Jetson Thor platform. The hardware-based security solution securely stores cryptographic keys and verifies system integrity at the chip level, establishing a certified, quantum-resilient root of trust for Physical AI systems. The int
2026-06-03
247wallst.com
2026-06-03
24/7 Wall St.
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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Data is a real-time snapshot *Data is delayed at least 15 minutes. Global Business and Financial News, Stock Quotes, and Market Data and Analysis.
2026-06-03
www.thelec.net
2026-06-03
thelec.net
Genesem says orders for HBM and advanced packaging equipment are becoming increasingly visible as the market expands. (Photo: THE ELEC)
Genesem said on Monday that orders for advanced packaging equipment are becoming increasingly visible as demand rises in the high-bandwidth memory (HBM) and advanced semiconductor packaging markets.
The company recently completed development of next-generation p
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
simplywall.st
2026-06-03
simplywall.st
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2026-06-03
pv-magazine-usa.com
2026-06-03
pv magazine USA
Anew reference design to support fast deployment of AI infrastructure with battery energy storage system (BESS) support has been developed by Siemens, Nvidia and Fluence.
Siemens announced the new DSX Vera Rubin AI factory reference design has been created to support the deployment of high energy density data centers.
Power densities in data centers are expected to increase significantly as the
2026-06-03
www.proactiveinvestors.co.uk
2026-06-03
Proactive Investors
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Written by:
Ian Lyall
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ASML Holding NV
(
NASDAQ:ASML
XETRA:ASME
)
View Price & Profile
JP Morgan raises ASML estimates as chipmaker signals it can supply far more EUV tools than previously guided
Published: 16:10 03 Jun 2026 BST
JP Morgan has concluded that consensus earnings estimates for ASML Holding N
2026-06-03
news.financial
2026-06-03
news.financial
June 3rd, 2026 | 10:30 CEST
SIMPLE AND BRUTAL: NO NUCLEAR POWER, NO AI - WHY AMERICAN ATOMICS, INFINEON, AND AIXTRON PLAY KEY ROLES
NUCLEAR
AI
URANIUM
SOFTWARE
Photo credits: Pixabay
The energy demand of artificial intelligence and data centres is enormous. Studies consistently show that no single energy source will be sufficient; instead, a diversified energy mix will be required to meet ri
2026-06-03
www.gasworld.com
2026-06-03
gasworld
© Air Liquide
Air Liquide to supply SK hynix with €200m plant in South Korea
By Molly Burgess
9 min ago
2 min read
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Industrial gas major Air Liquide will build a nitrogen production unit in South Korea, worth nearly €200m ($232m), to supply memory chipmaker SK hynix under a newly signed long-term contract.
Set to be operational by late 2027, the plant will supply high-purity gases and hi
2026-06-03
www.digitimes.com
2026-06-03
digitimes
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary, combining two processor IP portfolios into a single offering that...
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2026-06-03
www.foreignpolicyjournal.com
2026-06-03
foreignpolicyjournal.com
Broadcom (NASDAQ: AVGO) posted a gain of nearly 3% on Monday, emerging as one of the session’s standout performers in a market defined by sharp moves across technology stocks.
Micron (NASDAQ: MU) surged more than 6.6% on the day, making it one of the strongest individual performers among major semiconductor names during the session.
Archaeologists uncover centuries of history beneath Notre-Dame
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
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2026-06-03
Yahoo Finance
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2026-06-03
simplywall.st
2026-06-03
simplywall.st
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2026-06-03
www.digitimes.com
2026-06-03
digitimes
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and...
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