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Trending Technologies
EUV167 3nm141 AI chips69 AI65 HBM60 DRAM60 GPU52 memory chips33 AI infrastructure19 NAND flash18 semiconductor17 data center14 2nm14 NAND12 data centers12
2026-07-09
Advanced packaging tech set for market in two years - The Sun Malaysia
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thesun.my 2026-07-09 The Sun Malaysia
2026-07-09
Semiconductor Encapsulating Transparent Resin Market Forecast to 2035: Growth Driven by Advanced Packaging and Miniaturization - News and Statistics - IndexBox
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www.indexbox.io 2026-07-09 IndexBox
2026-07-09
Foxconn builds integrated semiconductor ecosystem spanning IC design, SiC, and advanced packaging - digitimes
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www.digitimes.com 2026-07-09 digitimes
2026-07-09
Foxconn builds integrated semiconductor ecosystem spanning IC design, SiC, and advanced packaging
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digitimes.com 2026-07-09
Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early as 2026, potentially on the Taiwan Innovation Board. While Liu did not identify the company, industry observers believe the most likely candidate is Socle Technology Corp (Socle).
2026-07-08
Can AMAT's Advanced Packaging Drive Its Next Growth Phase? - Yahoo Finance
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finance.yahoo.com 2026-07-08 Yahoo Finance
2026-07-08
Can AMAT's Advanced Packaging Drive Its Next Growth Phase? - TradingView
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www.tradingview.com 2026-07-08 TradingView
2026-07-08
JEDEC releases new SPHBM4 standard to slash AI memory costs
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tomshardware.com 2026-07-08 Anton Shilov
SPHBM4 promises HBM4-class bandwidth without usage of silicon interposer and CoWoS-like packaging.
JEDEC standardHigh Bandwidth MemoryAI processorsHBM4SPHBM4Memory technologySemiconductor industryChip design
2026-07-08
Semiconductor Mold Rubber Cleaning Sheet Market Growth Driven by Advanced Packaging Demand Through 2035 - News and Statistics - IndexBox
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www.indexbox.io 2026-07-08 IndexBox
2026-07-08
TSMC CoWoS packaging service - capacity push for demanding AI chips - AD HOC NEWS
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www.ad-hoc-news.de 2026-07-08 AD HOC NEWS
2026-07-08
Advanced packaging is poised for a pivotal shift: Goldman Sachs is bullish on the leading glass substrate player, while Ming-Chi Kuo strongly backs Taiwan Semiconductor (TSM.US). - Moomoo
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www.moomoo.com 2026-07-08 Moomoo
2026-07-08
The Latest News In IC Packaging & Test - Semiecosystem
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marklapedus.substack.com 2026-07-08 Semiecosystem
2026-07-08
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
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digitimes.com 2026-07-08
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.
2026-07-08
Nexperia’s 1200 V SiC MOSFETs in QDPAK packaging - Electronics Weekly
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www.electronicsweekly.com 2026-07-08 Electronics Weekly
2026-07-07
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging - Business Wire
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news.google.com 2026-07-07 Business Wire
2026-07-07
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
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tomshardware.com 2026-07-07 Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
Semiconductor MemoryHigh-Bandwidth MemoryHBMSilicon InterposerMemory ArchitectureIntel PatentUCIe InterfaceBEOL Technology
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 - GlobeNewswire
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www.globenewswire.com 2026-07-07 GlobeNewswire
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics - Yahoo Finance UK
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uk.finance.yahoo.com 2026-07-07 Yahoo Finance UK
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics - Yahoo Finance
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finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging
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semiengineering.com 2026-07-07 Anne Meixner
Optical methods need to comply with increasing warpage, finer RDL pitch, and trace size.
Semiconductor PackagingPanel-Level PackagingHigh-Density Fan-OutInspection TechnologyMetrology EquipmentAI ChipsHPC DevicesRDL Layers
2026-07-07
TSMC's AI bottleneck spills demand across the semiconductor supply chain
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digitimes.com 2026-07-07
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac