Semiconductor News & Analysis Feed
548 articles
2026-06-24
digitimes.com
2026-06-24
South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments, as the two chipmakers review plans that could include front-end fabrication plants and packaging facilities across the country's Honam and Chungcheong regions. Both companies say no final decisions have been made.
2026-06-24
pulse2.com
2026-06-24
Pulse 2.0
Qnity Electronics announced the launch of its Advanced Packaging Innovation Hub, a new online platform showcasing the company’s material and technology solutions for advanced packaging.
The launch highlights advanced packaging as a strategic growth driver and innovation priority for Qnity. The company said its solutions are designed to support next-generation artificial intelligence, high-perform
2026-06-24
www.insidermonkey.com
2026-06-24
Insider Monkey
NEWS
Why ASMPT Limited’s (ASMVY) Repeat TCB Tool Order Deepens Its Role in HBM and AI Packaging
Published on June 23, 2026 at 12:10 pm by HABIB UR REHMAN in News
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ASMPT Limited (OTC:ASMVY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company sharpened its HBM relevance on June 8, 2026, when it announced a repeat order for eight chip-to-wafer Thermo-Compression Bondi
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
How BE Semiconductor Industries (BESIY) Is Turning Hybrid Bonding Demand Into a Bigger AI Packaging Growth Target
Habib Ur Rehman
Tue, June 23, 2026 at 9:10 AM PDT 2 min read
BESI.AS
-0.37%
BE Semiconductor Industries N.V. (OTC:BESIY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company strengthened its HBM-adjacent case on June 18, 2026, when it raised its long-term rev
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
Why ASMPT Limited’s (ASMVY) Repeat TCB Tool Order Deepens Its Role in HBM and AI Packaging
Habib Ur Rehman
Tue, June 23, 2026 at 9:10 AM PDT 1 min read
0522.HK
+3.13%
ASMPT Limited (OTC:ASMVY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company sharpened its HBM relevance on June 8, 2026, when it announced a repeat order for eight chip-to-wafer Thermo-Compression Bondin
2026-06-24
www.marketscreener.com
2026-06-24
marketscreener.com
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2026-06-23
www.manilatimes.net
2026-06-23
The Manila Times
Production-ready 3DI technology supports more compact FEMs for advanced 5G devices
MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-pe
2026-06-23
gf.com
2026-06-23
GlobalFoundries
gf.com
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2026-06-23
www.moomoo.com
2026-06-23
Moomoo
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2026-06-23
finimize.com
2026-06-23
Finimize
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2026-06-23
digitimes.com
2026-06-23
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing applications in advanced packaging, optical transmission and third-generation semiconductors. The rollout covers simultaneous construction and capacity ramp projects at Erlin, Zhengzhou, and Zhunan to align production
2026-06-23
digitimes.com
2026-06-23
Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.
2026-06-23
www.investing.com
2026-06-23
Investing.com
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2026-06-23
ca.investing.com
2026-06-23
Investing.com Canada
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2026-06-23
www.streetinsider.com
2026-06-23
StreetInsider
www.streetinsider.com
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2026-06-23
sg.finance.yahoo.com
2026-06-23
Yahoo Finance Singapore
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Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Business Wire
Mon, 22 June 2026 at 1:30 pm GMT-7 2 min read
Q
-8.23%
Qnity’s material innovations enable next-generation advanced packaging, showcased through new Innovation Hub
WILMINGTON, Del., June 22, 2026--(BUSINE
2026-06-23
www.lincolnjournal.com
2026-06-23
lincolnjournal.com
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2026-06-23
news.google.com
2026-06-23
Business Wire
2026-06-23
www.marketscreener.com
2026-06-23
marketscreener.com
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2026-06-23
wccftech.com
2026-06-23
Wccftech
SPHBM4 is a new JEDEC standard that aims to solve the high cost and packaging concerns with existing HBM technologies.
Almost all AI & HPC accelerators rolling out these days feature some form of HBM memory. The highest-end solutions are leveraging the latest HBM4 designs, and HBM4E is being sampled to the top chipmakers.
But as demand continues to rise, and shortages persist in the premium DRAM