Semiconductor News & Analysis Feed
461 articles
2026-05-26
www.eejournal.com
2026-05-26
EEJournal
May 26, 2026
You Say “Ultra-Low-Power Connected Edge AI,” I Say “Nordic Semiconductor”
by Max Maxfield
There are many ways to slice and dice embedded engineering space (where, as everyone should know by now, no one can hear you scream). Take microcontrollers, for example. If I were to raise the topic of MCUs in a room full of embedded engineers, it wouldn’t take long before names like STMicroelec
2026-05-26
ir.microchip.com
2026-05-26
Microchip Technology
Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers
May 26, 2026 8:00 am EDT
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New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation
CHANDLER, Ariz., May 26, 2026 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announces the ava
2026-05-26
news.google.com
2026-05-26
Stock Titan
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2026-05-26
www.morningstar.com
2026-05-26
Morningstar
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2026-05-26
news.google.com
2026-05-26
Business Wire
2026-05-26
www.bisinfotech.com
2026-05-26
Bisinfotech
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2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
www.presseagentur.com
2026-05-26
presseagentur.com
ROHM at PCIM Europe 2026: Advancing SiC Power Technology for E-Mobility and Industry
Willich/Nuremberg, Germany, May 26, 2026 – ROHM will exhibit at PCIM Expo & Conference 2026, the leading international event for power electronics, intelligent motion, renewable energy and energy management – taking place June 9 to 11, 2026, in Nuremberg, Germany.
This year, ROHM invites its visitors to booth 31
2026-05-26
timestech.in
2026-05-26
TimesTech
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.thefastmode.com
2026-05-26
The Fast Mode
Stellantis and Qualcomm Technologies announced an expansion of their multi-year technology collaboration to power next-generation Stellantis vehicles with Qualcomm Technologies’ Snapdragon® Digital Chassis™ system-on-chips (SoCs).
The expanded collaboration integrates Snapdragon Digital Chassis solutions with STLA Brain, Stellantis’ electronic and software platform, enhancing cockpit, connectivit
2026-05-26
www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
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2026-05-26
digitimes.com
2026-05-26
Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure on power supply, production capacity, and critical component availability.
2026-05-26
digitimes.com
2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt
2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com
2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is also beginning to see emerging demand from diversified applications such as AI robotics. As a result, production capacity in 2026 has alread