Semiconductor News & Analysis Feed

5 articles
2026-07-01
tomshardware.com 2026-07-01 Anton Shilov
AMD confirms plans to incorporate low-power CPU cores into next-generation heterogeneous CPUs to lower power consumption and improve energy efficiency.
2026-06-17
www.sony-semicon.com 2026-06-17 sony-semicon.com
Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the LYTIA L910, an approximately 50-effective megapixel*1 image sensor for mobile applications delivering 100 dB high dynamic range imaging with low power consumption. This is the first product in the LYTIA lineup with the LOFIC*2 structure. It also features the new HDR technology and logic circuit technology
2026-06-10
digitimes.com 2026-06-10
WD is preparing for a global wave of AI data growth by prioritizing hard drives with higher capacity, faster performance, and lower power consumption. The company says the shift reflects how AI training and inference are generating more data than traditional systems can handle, making storage efficiency and affordability increasingly important worldwide.
2026-06-02
eetimes.com 2026-06-02 Yashasvini Razdan
Dutch sensor manufacturer ScioSense has launched its fourth-generation ultrasonic flow converter (UFC), called UFC23, for water, heat, and gas metering applications. The company said the new sensor combines high measurement precision, improved offset stability, and ultra-low power consumption for battery-powered smart metering systems. The company’s latest product is designed as pure front-end arc
2026-05-26
digitimes.com 2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt