Semiconductor News & Analysis Feed

Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.

Infineon's EiceDRIVER 1EDI3040AS. (Photo: Infineon) Infineon Technologies on June 3 local time introduced new gate driver integrated circuits (ICs) for electric vehicle (EV) traction inverters, named EiceDRIVER 1EDI3040AS and 1EDI3041AS. Gate drivers are chips that send switching signals to power semiconductor devices. In traction inverters, these switches rapidly open and close to convert batte

Intel's next-generation 12V-only PSU standard reportedly adds PMBus support, smaller connectors, and improved power efficiency.

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Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.

分享 LinkedIn Teams WhatsApp Facebook Email X Neil Tyler 27 May 2026 More in Power Industrial Electronics Artificial Intelligence RECOMMENDED STMicroelectronics introduces 700V GaN devices to improve power efficiency Product Launches 2 mins read STMicroelectronics has launched a new range of gallium nitride (GaN)-based power semiconductors aimed at improving energy efficiency and power dens

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