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Intel says its 14A process technology is on track for high-volume manufacturing in 2029, 10A and 7A to follow in the 2030s.

Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology is now rippling into legacy memory, packaging, and testing.

TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leve

Intel is gaining momentum in both chip design and foundry operations. Its PC platform roadmap for the next two years is coming into sharper focus as process technology and yield improve, according to PC supply-chain sources.