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2026-05-21
AMD Announces Production Ramp of Next-Generation AMD EPYC Processor “Venice” on TSMC 2nm Process Technology - AMD
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news.google.com 2026-05-21 AMD
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2026-05-20
Beyond HBM: Why 3D-Stacked SRAM Is Becoming Critical to AI Processor Architecture - semivision
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tspasemiconductor.substack.com 2026-05-20 semivision
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2026-05-19
ADI to Acquire IVR Tech to Join Data Center’s Power Gold Rush
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eetimes.com 2026-05-19 Majeed Ahmad
Empower Semiconductor’s integrated voltage regulators (IVRs) can be placed directly inside an AI processor package.
Analog DevicesPower ManagementData CentersAI ChipsPower SemiconductorsIntegrated Voltage RegulatorSemiconductor AcquisitionAI Accelerators
2026-05-19
Evaluating RISC-V Vector Processors: GCC vs. LLVM Autovectorization Benchmarks (May 2026) - News and Statistics - IndexBox
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www.indexbox.io 2026-05-19 IndexBox
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2026-05-19
Evaluating and Calibrating Performance On RISC-V Vector Processors (KTH, LLNL, BSC) - Semiconductor Engineering
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semiengineering.com 2026-05-19 Semiconductor Engineering
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2026-05-13
Now you can put a SpacemiT K3 RISC-V processor in a Framework Laptop 13 - Liliputing
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liliputing.com 2026-05-13 Liliputing
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2026-05-09
Qualcomm to introduce processors based on 2nm and 3nm processes in 2026 - GameGPU
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en.gamegpu.com 2026-05-09 GameGPU
Qualcomm plans to launch an expanded processor lineup in the fourth quarter of 2026 to ensure device diversification. The company will introduce the flagship Snapdragon 8 Elite Gen 6 and Gen 6 Pro solutions based on TSMC's 2 nm process technology. The use of new lithography significantly increases production costs, forcing electronics manufacturers to seek ways to maintain profits amid the protrac
Qualcommprocessor2nm process3nm processTSMCsemiconductor industrymobile chipsmartphone
2026-05-05
Is the 'chip shortage' constraining iPhone sales? Apple is reportedly considering having Intel and Samsung manufacture its device processors. - Moomoo
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www.moomoo.com 2026-05-05 Moomoo
2026-04-14
BSC Spinoff to Secure Chips for Critical Infrastructure
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eetimes.com 2026-04-14 Pablo Valerio
BSC and UPC launch a spin-off creating auditable processor architecture for European critical infrastructure.
Semiconductor Supply ChainEuropean Technological SovereigntyCritical Infrastructure SecurityChip DesignRISC-V ArchitectureSecure ChipsSupercomputing CenterEU Technology Policy
Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex
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digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se