Semiconductor News & Analysis Feed

15 articles
2026-07-05
digitimes.com 2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-06-30
digitimes.com 2026-06-30
Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.
2026-06-26
digitimes.com 2026-06-26
As growth in the traditional consumer electronics market slows and industry competition intensifies, LCD optical film manufacturer Optivision Technology is accelerating its transition toward higher-value automotive applications. The company has reduced its production lines from 16 to 13 in response to changing demand dynamics in the display industry, aiming to optimize asset utilization and improv
2026-06-23
www.thelec.net 2026-06-23 thelec.net
Jay Y. Lee inspects the C1 and C2 production lines at Samsung Electronics' Cheonan campus. (Photo: Samsung Electronics) Jay Y. Lee, executive chairman of Samsung Electronics, inspected the company's high-bandwidth memory (HBM) production operations in Cheonan, South Korea, reviewing supply readiness for HBM4 products that have recently generated strong business momentum. On June 23, Lee visited
2026-06-23
www.businesskorea.co.kr 2026-06-23 Businesskorea
Visit to Cheonan Signals Push for AI Chip Leadership Samsung Electronics Executive Chairman Jay Y. Lee inspects the cleanroom facilities of NRD-K, an advanced converged semiconductor research and development center, at Samsung Electronics’ Giheung Campus on December 22 last year. (Source = Samsung Electronics) Samsung Leads HBM4 Mass Production in February, Delivers 12-Layer HBM4E Samples to Glob
2026-06-23
www.asiae.co.kr 2026-06-23 아시아경제
Key Production Hub for HBM Backend Processing and Advanced Packaging Soaring HBM Demand Driven by AI... Leadership Strengthened HBM4 Surpasses $1 Billion in Cumulative Sales in Just Four Months Samsung Electronics Chairman Lee Jae-Yong visited the company’s Cheonan site in South Chungcheong Province, where high-bandwidth memory (HBM) is produced, to personally inspect the production facilities.
2026-06-23
www.asiae.co.kr 2026-06-23 아시아경제
Key Production Hub for HBM Backend Processing and Advanced Packaging Soaring HBM Demand Driven by AI... Leadership Strengthened HBM4 Surpasses $1 Billion in Cumulative Sales in Just Four Months Samsung Electronics Chairman Lee Jae-Yong visited the company’s Cheonan site in South Chungcheong Province, where high-bandwidth memory (HBM) is produced, to personally inspect the production facilities.
2026-06-23
en.sedaily.com 2026-06-23 Seoul Economic Daily
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2026-06-22
digitimes.com 2026-06-22
Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from four companies, led by MSScorps, which will invest NT$1.5 billion (US$47.4 million) and is filing for the third time. The company plans to add production lines and adopt AI technology at its Hsinchu, Tai Yuen Hi-Tech Industrial Park, and Southern Taiwan Science Park (
2026-06-22
digitimes.com 2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-17
digitimes.com 2026-06-17
Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asiareported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.
2026-06-10
www.moomoo.com 2026-06-10 Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here. 智通财经APP获悉,光大证券发布研报称,玻璃基板凭借其优异特性,逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点,且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建
2026-06-05
www.ledinside.com 2026-06-05 LEDinside
Recently, West Lake Yanshan Technology (Hangzhou) Co., Ltd. officially commenced production at what it claims is the world’s first 8-inch GaN-on-Silicon Micro LED IDM mass production line, located at its factory in Deqing, Zhejiang Province. The newly launched line adopts a full-chain IDM model, covering the entire manufacturing process from epitaxial material growth and chip fabrication to advan
2026-06-05
news.google.com 2026-06-05 LEDinside
2026-05-04
news.samsung.com 2026-05-04 samsung.com