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2026-06-11
Nexperia introduces 1200V SiC MOSFETs in QDPAK packaging to address thermal challenges - New Electronics
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www.newelectronics.co.uk 2026-06-11 New Electronics
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SiC MOSFETPower SemiconductorThermal ManagementCarbon SiliconPower DeviceElectric VehicleIndustrial ApplicationSemiconductor Packaging
2026-06-09
Nexperia adds QDPAK to 1200 V SiC MOSFET portfolio - Automotive World
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www.automotiveworld.com 2026-06-09 Automotive World
QDPAK's top-side thermal path allows the PCB and semiconductor domains to be managed separately, unlocking more power in less space June 9, 2026 Nexperia has launched 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging for electric vehicle (EV) and industrial power conversion, enabling up to 3 kW more output power than conventional D2PAK-7 devices at comparable thermal limits. The portfolio
SiC MOSFETQDPAK packagingelectric vehicleindustrial power conversionthermal managementpower devicesemiconductorwide bandgap