Semiconductor News & Analysis Feed
630 articles
2026-05-27
www.cnbc.com
2026-05-27
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2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CUDA 13.3 brings new capabilities and performance optimizations to developers across the CUDA ecosystem. The launch of NVIDIA CUDA Tile programming in C++, enables high-level, tile-based kernel development that automatically manages complex low-level GPU details for optimal performance and portability. Additionally, CUDA Tile programming is now supported on Compute Capability 9.0 (NVIDIA Ho
2026-05-27
simplywall.st
2026-05-27
simplywall.st
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2026-05-26
futurumgroup.com
2026-05-26
The Futurum Group
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2026-05-26
tomshardware.com
2026-05-26
Kunal Khullar
The Holo 360 replaces conventional LCD layering with a floating hologram-like image effect.
2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
evertiq.com
2026-05-26
Evertiq
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production...
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activa
2026-05-26
www.digitimes.com
2026-05-26
digitimes
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activa
2026-05-26
penangtoday.my
2026-05-26
PenangToday
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2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com
2026-05-26
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20 weeks. As a result, some orders that once went to major Japanese and South Korean suppliers are gradually spilling over to Taiwan-based makers.
2026-05-26
digitimes.com
2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
2026-05-26
digitimes.com
2026-05-26
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of WIN Semiconductors, said the company is actively advancing a range of products, including driver ICs, continuous-wave (CW) lasers, and photodiodes, while also ramping up capacity in anticipation of growing demand from next-generation networks.
2026-05-26
www.cnbc.com
2026-05-26
CNBC
First, welcome to all who have joined us for the first time. Your participation in the CNBC Investing Club means a great deal to us. We aspire to get it right for you, in the same way a wonderful Club member explained this weekend as we gardened together. He couldn’t believe how much he had learned and how much he had prospered from it. I can only express gratitude to him. Here’s why — from 1983 t
2026-05-25
wccftech.com
2026-05-25
Wccftech
TSMC has moved rapidly to quell a wave of discontent among its employees following the widespread dissemination of rumors related to impending bonus cuts, with such fears only bolstered by the recent comments from TSMC's CEO himself.
Now, amid fears of a Samsung-like upheaval that might disrupt its intricate production cadence, TSMC has just assured its employees that their bonuses will grow at a
2026-05-25
www.thelec.net
2026-05-25
thelec.net
Micron's sixth-generation high bandwidth memory (HBM4) production ramp-up is progressing smoothly. (Photo: Micron)
Micron Technology's ramp-up of sixth-generation high bandwidth memory (HBM4) production capacity is progressing smoothly. The company also plans to begin mass production of next-generation HBM4E standard products next year.
Manish Bhatia, executive vice president of global operation