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Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.

Semiconductor Memory High-Bandwidth Memory HBM Silicon Interposer Memory Architecture Intel Patent UCIe Interface BEOL Technology

Synopsys Axes Legacy EDA Software, Samsung and SK Hynix Fabs Face 'Brain Transplant' Transition - finance.biggo.com

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finance.biggo.com 2026-07-07 finance.biggo.com

TSMC places bulk orders, Cadence pursues serial acquisitions: Is the AI chip landscape on the verge of transformation? - 36 Kr

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eu.36kr.com 2026-07-07 36 Kr

Transcend posts record revenue in 2Q26 on strong demand

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digitimes.com 2026-07-07

Memory module maker Transcend Information reported consolidated revenue of NT$5.07 billion (approx. US$138.66 million) for June 2026. Revenue declined 19.5% from the previous month due to customer inventory adjustments at the end of the quarter, but it still surged 381.6% compared with June 2025.

Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides

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digitimes.com 2026-07-07

As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip

Lenovo confirms YMTC SSDs in notebooks sold outside China

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digitimes.com 2026-07-07

Lenovo confirmed that some notebooks sold outside China now use solid-state drives from Yangtze Memory Technologies Co. (YMTC), marking the first known appearance of the Chinese memory maker's SSDs in an overseas Lenovo model. The move comes as global PC makers face tighter NAND flash supply and higher prices.

Multi-die Testing In The Field Must Build On Established Test Methodologies

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semiengineering.com 2026-07-07 Laura Peters

Having a device that works at time zero is no longer a guarantee of reliability over it...

Multi-chip system testing In-field testing Silicon aging AI accelerators Data center hardware Automotive electronics 2.5D integration 3D-IC

Japanese startup completes AI chip validation with Oppstar and UMC support, moves toward mass production

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digitimes.com 2026-07-07

Tokyo Artisan Intelligence said it has finished validating its Sting Ray test chip, a step that could broaden access to lower-power edge AI hardware for industries worldwide. The milestone highlights how startups and foundries are pushing specialized chips that may ease energy pressure from AI, even as they support real-time applications in factories, transport, and infrastructure.

TSMC's Winbond DRAM Deal Isn't Domination, It's Insurance. Here's What It Actually Means for Chip ETFs - 24/7 Wall St.

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news.google.com 2026-07-06 24/7 Wall St.

TSMC’s Winbond DRAM Deal Isn’t Domination, It’s Insurance. Here’s What It Actually Means for Chip ETFs - Yahoo Finance

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news.google.com 2026-07-06 Yahoo Finance

SQC Adds Cadence Veteran To Lead Legal, Governance Scaling - Quantum Zeitgeist

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news.google.com 2026-07-06 Quantum Zeitgeist

Nvidia's Jetson Orin Nano Platform: Transforming Edge Computing with Multimodal AI Inference Gateways - Yahoo Finance

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news.google.com 2026-07-06 Yahoo Finance