Semiconductor News & Analysis Feed
471 articles
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-06
digitimes.com
2026-07-06
Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.
2026-07-06
digitimes.com
2026-07-06
Anthropic's reported move into in-house chip development could matter well beyond Silicon Valley if it helps lower the cost of running AI services worldwide. By prioritizing cheaper inference rather than elite performance, the startup may be signaling a more pragmatic path that could influence how global AI systems are built and priced.
2026-07-06
digitimes.com
2026-07-06
Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.
2026-07-06
digitimes.com
2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
digitimes.com
2026-07-06
Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial public offering (IPO) in 2028.
2026-07-06
news.google.com
2026-07-06
Boston Herald
2026-07-05
news.google.com
2026-07-05
Stocktwits
2026-07-05
news.google.com
2026-07-05
Pandaily
2026-07-05
digitimes.com
2026-07-05
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence (AI) and high-performance computing workloads increase demand for silicon photonics and co-packaged optics in data centers.
2026-07-05
digitimes.com
2026-07-05
Test interface supplier Chunghwa Precision Test Tech. Co., Ltd. (CHPT) reported its June 2026 revenue, marking its sixth consecutive monthly revenue record as demand from the market remained strong. The company also posted record quarterly revenue in both the first and second quarters of 2026, underscoring its sustained growth momentum.
2026-07-04
digitimes.com
2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-04
finance.yahoo.com
2026-07-04
Yahoo Finance
2026-07-03
unn.ua
2026-07-03
Українські Національні Новини (УНН)
2026-07-03
www.benzinga.com
2026-07-03
Benzinga
2026-07-03
digitimes.com
2026-07-03
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
2026-07-03
news.google.com
2026-07-03
MarketWatch
2026-07-02
www.phoronix.com
2026-07-02
Phoronix
2026-07-02
www.indexbox.io
2026-07-02
IndexBox
2026-07-02
www.rfi.fr
2026-07-02
RFI