Semiconductor News & Analysis Feed
399 articles
2026-05-28
www.tradingview.com
2026-05-28
TradingView
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2026-05-28
www.gsmarena.com
2026-05-28
GSMArena.com
Shortly after Huawei brought to light its new scaling law called Tao Scaling Law and its LogicFolding architecture, the company held a keynote at the Phoenix Bay Area Finance Forum and Financial Summit in Shenzhen, promising to bring a much more powerful, next-generation Kirin chipset that will power the upcoming Mate 90 lineup.
The chip in question is said to be the first mobile chip for the com
2026-05-28
blogs.nvidia.com
2026-05-28
NVIDIA Blog
AI factories are a new class of infrastructure built to manufacture intelligence that’s always on and in real time. In the industrial age, power plants converted energy into electricity. In the AI age, AI factories convert energy into tokens — the unit of production for reasoning models, agents and intelligent systems.
Their economics are defined by what they produce: tokens per second, tokens p
2026-05-28
blogs.nvidia.com
2026-05-28
NVIDIA Blog
AI factories are a new class of infrastructure built to manufacture intelligence that’s always on and in real time. In the industrial age, power plants converted energy into electricity. In the AI age, AI factories convert energy into tokens — the unit of production for reasoning models, agents and intelligent systems.
Their economics are defined by what they produce: tokens per second, tokens p
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
SK Hynix stock rally attracts retail investors amid AI spending surge
South Korean retail traders have poured nearly $13.2 billion into SK Hynix as the memory chipmaker's market cap crosses $1 trillio
2026-05-27
brief.bismarckanalysis.com
2026-05-27
Bismarck Brief
AI 2026
AI 2026: TSMC Risks Being a Bottleneck on AI Progress
The world's most valuable chipmaker is a repository of unique industrial expertise. Its businesslike conservatism about AI however risks the company's position being disrupted by competitors.
SAMO BURJA
MAY 27, 2026
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TSMC Fab 16 in China. Photo from Taiwan Semiconductor Manufacturing Co., Ltd. Source.
This Bismarck Brief wi
2026-05-27
www.huaweicentral.com
2026-05-27
Huawei Central
HUAWEI
Mate 90 series chip will be close to 3nm process tech: Huawei
Published
16 minutes ago
on
May 27, 2026
By
Emiko Matsui
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Huawei has made another statement regarding the Mate 90 series chip tech, which may draw level with the 3nm process technology. The company stated this at the 2026 Phoenix Bay Area Finance Forum and Financial S
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
SK Hynix surpasses $1T market value amid AI chip boom
South Korea's memory chipmaker joins Samsung and Micron in the trillion-dollar club, powered by insatiable demand for AI server hardware.
2026-05-27
www.gizmochina.com
2026-05-27
Gizmochina
HuaweiNews
Huawei Mate 90 series officially confirmed to feature 3nm chip, could be called Kirin 9050 Pro
By Anvinraj Valiyathara -
May 27, 2026
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Huawei appears to be preparing a major leap in smartphone chip technology with the upcoming Huawei Mate 90 series. During a recent finance-focused 20th Shenzhen International Financial Expo
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
Nvidia plans $150B annual investment in Taiwan for AI revolution
Jensen Huang calls Taiwan the 'epicentre' of AI as Nvidia ramps spending from $100B to $150B per year, with a new headquarters set for
2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
Huawei unveils new chip design approach, sparking investor interest in Chinese semiconductor stocks
The Tau Scaling Law ditches the traditional playbook of shrinking transistors, offering Huawei a cre
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
Micron and SK Hynix join trillion-dollar club amid chip boom
The memory chip oligopoly is now worth a combined $3 trillion, and AI's insatiable appetite for high-bandwidth memory is the reason.
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
Taiwan suspects smuggling of Nvidia chips to China via Japan in first formal crackdown
Taiwanese prosecutors have charged three individuals with forging export documents to reroute roughly 50 Supermic
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
Micron approaches $1T market value as UBS triples price target to $1,625
UBS analyst Timothy Arcuri set the Street-high target on the memory chipmaker, citing AI-driven demand for high-bandwidth memor
2026-05-27
www.ad-hoc-news.de
2026-05-27
AD HOC NEWS
Infineon, Defies
Infineon Defies Iran Jitters and Patent Battles to Touch Fresh Peak, Even as One Analyst Cries Overbought
27.05.2026 - 04:22:42 | boerse-global.de
Infineon stock doubles in 2026, hits €77.69 record on GaN patent win, AI data center pivot, and restructuring. One analyst issues sell with €60 target.
Infineon Defies Iran Jitters and Patent Battles to Touch Fresh Peak, Even as One A
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
TSMC plans price hikes for advanced chips starting 2026, squeezing AI hardware costs
The world's most important chipmaker is raising prices on its cutting-edge manufacturing nodes, and the ripple effe
2026-05-27
cryptobriefing.com
2026-05-27
Crypto Briefing
Taiwan Semiconductor plans 15% price hike for 3nm chips in H2 2026
TSMC's aggressive pricing strategy reflects an AI demand surge that could ripple into crypto mining economics and consumer electronic
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.