Semiconductor News & Analysis Feed
987 articles
2026-06-16
www.bastillepost.com
2026-06-16
bastillepost.com
KYOTO, Japan--(BUSINESS WIRE)--Jun 15, 2026--
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis
2026-06-16
www.ncnewsonline.com
2026-06-16
New Castle News
KYOTO, Japan--(BUSINESS WIRE)--Jun 15, 2026--
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis
2026-06-16
www.joplinglobe.com
2026-06-16
The Joplin Globe
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[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
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2026-06-16
www.bdtonline.com
2026-06-16
Bluefield Daily Telegraph
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2026-06-16
www.caledonianrecord.com
2026-06-16
Caledonian Record
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AP
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic
2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
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Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Business Wire
Mon, 15 June 2026 at 7:00 pm GMT-7 3 min read
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[Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
KYOTO, Japan, June 16, 2026--(B
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
www.mykxlg.com
2026-06-16
mykxlg.com
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2026-06-16
via.tt.se
2026-06-16
Via TT
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
16.6.2026 04:00:00 CEST | Business Wire | Press Release
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Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access an
2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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2026-06-16
www.marketscreener.com
2026-06-16
marketscreener.com
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2026-06-16
ourworldindata.org
2026-06-16
Our World in Data
Spending on the hardware that trains and runs artificial intelligence has grown rapidly over the past years. One of the clearest indicators of how rapidly spending has increased is the revenue of American chipmaker NVIDIA.
The company accounts for around 85% of the global market for AI chips. These are graphics processing units (GPUs), originally built for video games but well-suited to the paral
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
digitimes.com
2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.