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Trending Technologies
3nm9 EUV9 GPU8 Vera Rubin platform4 AI4 AI chips4 Rubin Ultra3 HBM3 AI chip2 AI data center2 HBM3E2 AI servers2
2026-08-29
Glow-Up or AI Slop? Nvidia's Controversial DLSS 5 Leaks Early Through Mods - PCMag
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www.pcmag.com 2026-08-29
2026-08-29
'The Last of Us,' 'Skyrim' and More Get Unreal Makeovers With Nvidia's Controversial AI Tech - Polygon.com
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news.google.com 2026-08-29
2026-08-28
SK Hynix held a groundbreaking ceremony for its packaging facility in Indiana, USA, and signed a research and development MOU with Purdue University. - expreview.com
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www.expreview.com 2026-08-28
2026-08-28
SK Hynix CEO Warns Memory Shortage Will Persist Through 2030 as Chipmaker Builds $4 Billion Indiana Fab - Yahoo Finance
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finance.yahoo.com 2026-08-28
2026-08-28
SK Hynix CEO Warns Memory Shortage Will Persist Through 2030 as Chipmaker Builds $4 Billion Indiana Fab - Yahoo Finance
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finance.yahoo.com 2026-08-28
2026-08-28
Is NVIDIA's bull market restarting!? Up to 140% upside potential? CEO Jensen Huang regrets "missed investment opportunities" in OpenAI and Anthropic, makes a big bet on an AI version of GitHub for $12.9 billion! What is his true aim? - Moomoo
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www.moomoo.com 2026-08-28
2026-08-28
SK Hynix: HBM Shortage May Persist Through End of 2030; Expanding Capacity Across U.S., South Korea, and Japan - finance.biggo.com
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finance.biggo.com 2026-08-28
2026-08-28
Huawei's Ascend 910C sold out in China, but Nvidia's H200 supply gap persists
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digitimes.com 2026-08-28
2026-08-28
SK Hynix partners with Purdue University, ceremonially breaks ground on $4B memory chip facility - WLFI
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www.wlfi.com 2026-08-28
2026-08-28
SK Hynix CEO expects memory chip shortage to persist until 2030 - Moomoo
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www.moomoo.com 2026-08-28
2026-08-28
SK hynix breaks ground on $4 billion advanced packaging production facility in Purdue Research Park - Purdue University
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www.purdue.edu 2026-08-28
2026-08-27
Google, MediaTek embrace advanced packaging diversification - digitimes
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www.digitimes.com 2026-08-27
2026-08-27
Google, MediaTek embrace advanced packaging diversification
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digitimes.com 2026-08-27
2026-08-27
Nvidia doubles its revenue as demand for AI chips accelerate, but bubble fears persist - SiliconANGLE
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siliconangle.com 2026-08-27
2026-08-26
RIKEN Team Raises EUV Laser Conversion Efficiency 40% With Dual-Beam Method, Tackling Chipmaking's Power Problem - XenoSpectrum
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xenospectrum.com 2026-08-26
2026-08-24
Kyoto University builds transistor that survives 600C temperatures, compatible with standard fabs
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tomshardware.com 2026-08-24
Researchers at Kyoto University have developed a silicon carbide (SiC) transistor capable of operating at 600°C, using standard ion implantation techniques common in commercial chip fabrication. By employing a bottom-gate structure and double-well isolation, they significantly reduced the gap betwee
Silicon Carbide TransistorHigh-Temperature ElectronicsIon ImplantationPower DeviceSemiconductor MaterialFab ProcessWide Bandgap SemiconductorSilicon-based Device
2026-08-24
Micron Researcher Warns: The Memory Wall Persists as HBM Fails to Keep Pace with Rising Computing Speeds - Moomoo
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www.moomoo.com 2026-08-24
2026-08-24
Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design - digitimes
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www.digitimes.com 2026-08-24
2026-08-24
Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
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digitimes.com 2026-08-24
2026-08-22
Kureha, Tokyo University of Technology Launch SiC/SiC Composite Research for Aircraft Engines - International Business Times
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jp.ibtimes.com 2026-08-22