www.newelectronics.co.uk
2026-05-06
New Electronics
Organised by the School of Electrical and Electronic Engineering and supported by semiconductor firm EnSilica and a number of industry sponsors, the initiative used the Tiny Tapeout framework to deliver practical ASIC design experience. The approach, which uses a multi-project wafer (MPW) model, enables multiple designs to be manufactured together at reduced cost.According to organisers, the event
9to5mac.com
2026-05-05
9to5Mac
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AAPL COMPANY INTEL TSMC SAMSUNG ELECTRONICS
Report: Apple considers Intel and Samsung to diversify chip manufacturing away from TSMC
Marcus Mendes
| May 4 2026 - 8:45 pm PT
2 Comments
Bloomberg reports that Appl