Semiconductor News & Analysis Feed
82 articles
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
Capacity push for AI: TSMC’s CoWoS packaging ramps toward 140,000 wafers a month
16.06.2026 - 02:00:19 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging line is emerging as a quiet workhorse of the AI boom. Industry data now points to capacity as high as 120,000 to 140,000 wafers per month by 2026, as the Taiwanese foundry pours billions into a technology that has become critica
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-13
digitimes.com
2026-06-13
As cloud service providers ramp up investment in AI infrastructure, Edom chairman Wayne Tseng said rising costs for materials, production equipment and labour will keep overall market supply tight in the second half of 2026, with price increases likely to continue. He also said AI is moving from the cloud into enterprise applications, with power, cybersecurity, optics and the medical sector set to
2026-06-12
digitimes.com
2026-06-12
MediaTek reported May 2026 revenue of NT$47.43 billion (approx. US$1.5 billion), up 1.49% from the previous month and 4.99% from a year earlier. Cumulative revenue for the first five months of 2026 totaled NT$243.32 billion, down 1.59% from the same period last year.
2026-06-11
www.techinsights.com
2026-06-11
TechInsights
China Analysis: BYD Semiconductor’s Revenue Growth and Capacity Ramp-Up Outlook
2 Min Read September 19, 2025
BYD Semiconductor's rapid growth in power semiconductors sees revenue increase 5x since 2021, boosting its IGBT and SiC capabilities by 2026.
BYD Semiconductor has rapidly scaled its power semiconductor business, with revenue growing more than 5x since 2021 and wafer fab c
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks
Features
By Anton Shilov published 4 hours ago
TSMC kicks off unprecedented capacity expansion plan.
(Image credit: Getty Images / Jimmy Beunardeau)
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2026-06-09
semiengineering.com
2026-06-09
Anne Meixner
Scaling to tens of millions of CPO units per year requires the industry to first settle...
2026-06-08
www.engineering.com
2026-06-08
Engineering.com
www.engineering.com
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2026-06-03
www.tradingview.com
2026-06-03
TradingView
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2026-06-02
www.storagenewsletter.com
2026-06-02
StorageNewsletter
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2026-06-02
finance.yahoo.com
2026-06-02
Yahoo Finance
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2026-06-01
themachinemaker.com
2026-06-01
Machine Maker
AMD today announced that its next-generation AMD EPYC processor, codenamed “Venice,” has entered production ramp on TSMC’s advanced 2nm process technology in Taiwan. The company also confirmed plans to expand future production at TSMC’s fabrication facility in Arizona, further strengthening its global manufacturing footprint for high-performance computing and AI infrastructure.
The milestone mark
2026-06-01
siliconangle.com
2026-06-01
SiliconANGLE
Nvidia Corp. said early Monday at the Computex conference in Taipei that it’s gearing up the production of its forthcoming Vera Rubin platform, which is set to become the foundation of a new generation of artificial intelligence factories that will dominate the enterprise infrastructure story for years to come.
The company unveiled Vera Rubin for the first time in March at its annual GTC develope
2026-06-01
nvidianews.nvidia.com
2026-06-01
NVIDIA Newsroom
News Summary:
NVIDIA Vera Rubin is ramping into full production, with Taiwan’s top server makers and global supply chain leaders manufacturing Vera Rubin-based systems at scale — fueling AI labs, cloud providers and hyperscalers to build tomorrow’s intelligence.
Vera Rubin delivers the POD-scale foundation for next-generation AI factories — with 10x agent throughput at scale compared with the pre
2026-06-01
nvidianews.nvidia.com
2026-06-01
NVIDIA Newsroom
May 31, 2026
NVIDIA Vera BlueField-4 STX Brings Agentic AI Storage Processing With In-Silicon Security
New and Enhanced NVIDIA DOCA Security Capabilities for Vera BlueField-4 STX Help Protect AI Agents, Context Memory and File-Based Data Access Directly in SiliconNews Summary: New and enhanced ...
Read Press Release
2026-05-31
seekingalpha.com
2026-05-31
Seeking Alpha
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2026-05-31
seekingalpha.com
2026-05-31
Seeking Alpha
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2026-05-31
digitimes.com
2026-05-31
Facing memory shortages and Sharp's plan to shut down its Guishan K2 plant by the end of 2026, GIS chairman Hsien-Ying Chou said the company faces greater operational challenges in the second half of 2026. However, its transformation strategy is accelerating. Among its new businesses, optical waveguide products used in AI glasses and other applications began small-volume shipments in the first qua
2026-05-30
digitimes.com
2026-05-30
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.