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In its first-quarter 2026 earnings Q&A session on May 15, Semiconductor Manufacturing International Corporation (SMIC) outlined a strategic response to shifting global market dynamics. As leading international foundries and integrated device manufacturers...The article requires paid subscription.Subscribe Now

Semiconductor Manufacturing Foundry Services SMIC Global Capacity Shortage Process Flexibility Market Strategy International Foundries Chip Manufacturing

TSMC Advanced Process Nodes - AD HOC NEWS

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www.ad-hoc-news.de 2026-05-14 AD HOC NEWS

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Now you can put a SpacemiT K3 RISC-V processor in a Framework Laptop 13 - Liliputing

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liliputing.com 2026-05-13 Liliputing

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TSMC's Arizona project proceeds well but faces water, labor challenges - Focus Taiwan

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focustaiwan.tw 2026-05-11 Focus Taiwan

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Dimensity 8600 with 3nm process in works, flagship-level upgrades expected - Gizmochina

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www.gizmochina.com 2026-05-11 Gizmochina

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Qualcomm to introduce processors based on 2nm and 3nm processes in 2026 - GameGPU

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en.gamegpu.com 2026-05-09 GameGPU

Qualcomm plans to launch an expanded processor lineup in the fourth quarter of 2026 to ensure device diversification. The company will introduce the flagship Snapdragon 8 Elite Gen 6 and Gen 6 Pro solutions based on TSMC's 2 nm process technology. The use of new lithography significantly increases production costs, forcing electronics manufacturers to seek ways to maintain profits amid the protrac

Qualcomm processor 2nm process 3nm process TSMC semiconductor industry mobile chip smartphone

HBM and DRAM/NAND memory production capacity risks have been temporarily alleviated! Samsung's labor-management dispute enters mediation process. - 富途牛牛

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news.futunn.com 2026-05-08 富途牛牛

访问频繁，请稍后重试您所要访问的页面不在这儿，它可能正忙着刷牛牛圈，稍后就能恢复正常返回主页

Semiconductor memory HBM memory DRAM memory NAND flash Samsung Electronics Semiconductor capacity Memory market Supply chain risk

TTaiwan Semiconductor(TSM) Unveils A13 Process Node to Boost AI, HPC Performance - Yahoo Finance

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finance.yahoo.com 2026-05-08 Yahoo Finance

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QPAC Binders in Semiconductor and AlN Thermal Processing - AZoM

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www.azom.com 2026-05-05 AZoM

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Is the 'chip shortage' constraining iPhone sales? Apple is reportedly considering having Intel and Samsung manufacture its device processors. - Moomoo

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www.moomoo.com 2026-05-05 Moomoo

SūmerSports Test Shows Large Improvement in Processing Speed on NVIDIA DGX Station GB300 Platform - SumerSports

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sumersports.com 2026-05-05 SumerSports

TSMC's A16 process node will be ready for mass production later this year - PhoneArena

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www.phonearena.com 2026-05-04 PhoneArena

Sub-1nm Process Technology Won’t Arrive Till 2034, Logic Roadmap Highlights 2D FETs For 0.2nm & Sub 0.2nm Nodes By 2043-2046 - Wccftech

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wccftech.com 2026-05-03 Wccftech

BSC Spinoff to Secure Chips for Critical Infrastructure

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eetimes.com 2026-04-14 Pablo Valerio

BSC and UPC launch a spin-off creating auditable processor architecture for European critical infrastructure.

Semiconductor Supply Chain European Technological Sovereignty Critical Infrastructure Security Chip Design RISC-V Architecture Secure Chips Supercomputing Center EU Technology Policy

Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex

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digitimes.com

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se

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