1012 articles
2026-05-06
digitimes.com
2026-05-06
India's latest approvals could expand global display and chip sourcing as the country adds Mini/Micro LED GaN fabrication and large-scale packaging capacity. Global manufacturers and buyers may see new sourcing options as India deepens its production capabilities for displays, power devices, and automotive components.
2026-05-06
digitimes.com
2026-05-06
In a recent assessment of the semiconductor landscape, GlobalFoundries emphasized the critical need for supply chain resilience amid a "fragmented geopolitical environment." The company is positioning its three-continent manufacturing presence—spanning the US, Germany, and Singapore—as a strategic solution for global customers seeking to mitigate the risks associated with concentrated production.
2026-05-06
digitimes.com
2026-05-06
Power semiconductor maker Eris Technology reported consolidated revenue of NT$250 million (US$7.9 million) in April 2026, a company record and up 19% from a year earlier, executives said, as demand tied to AI robots and AI servers began moving from sampling into volume ramp-up. The company said the April result followed 16 months of operational adjustment and signaled a return to a growth track dr
2026-05-06
digitimes.com
2026-05-06
Semiconductor silicon wafer supplier GlobalWafers said during its May 5 earnings call that it is advancing its next-generation compound semiconductor strategy. In response to advanced packaging and thermal dissipation demand, the company is actively pursuing customer certification for 12-inch silicon carbide (SiC) wafers, while strong demand for gallium nitride (GaN) is driving plans to launch a s
2026-05-06
digitimes.com
2026-05-06
Buoyed by robust demand for artificial intelligence and the early success of price increases, Vanguard International Semiconductor Corporation (VIS) is projecting a stronger performance for the second quarter of 2026, with wafer shipments expected to rise by more than 10% from the previous quarter. Average selling prices are forecast to increase by 2% to 4%, while gross margins are likely to recov
2026-05-06
digitimes.com
2026-05-06
GlobalWafers expects the current semiconductor cycle to bottom in the first quarter of 2026, with both the speed and breadth of recovery exceeding prior expectations, as artificial intelligence (AI) demand continues to drive growth across the industry.
2026-05-06
digitimes.com
2026-05-06
Export controls on indium phosphide (InP) risk prolonging supply strains in the compound semiconductor market, GCS Holdings warned, affecting optical and RF component makers worldwide. The company said it has secured capacity and diversified sourcing ahead of the second half of 2026, signaling potential relief from first-half 2026 constraints for global customers and partners.
2026-05-06
digitimes.com
2026-05-06
Singapore semiconductor equipment and testing company AEM is facing a dual challenge of "physics and cost" as the AI era rewrites the limits and supply-chain logic of chip testing, CEO Samer Kabbani said. AI is also driving up to US$7 trillion in global infrastructure investment, he said, while forcing the industry to adapt to faster product cycles and far larger, more power-hungry packages.
2026-05-06
digitimes.com
2026-05-06
At SEMICON Southeast Asia 2026, SEMI President and CEO Ajit Manocha delivered a clear message: the semiconductor industry is entering a "multi-trillion-dollar journey," but capturing that growth will depend less on ambition and more on coordination, ecosystems, and long-term strategy.
2026-05-06
digitimes.com
2026-05-06
Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push into the CoWoS supply chain. The company said the move will accelerate capacity expansion and lower capital expenditure requirements as demand stabilizes after year-endinventory corrections.
2026-05-06
www.chartmill.com
2026-05-06
ChartMill
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2026-05-06
www.marketbeat.com
2026-05-06
MarketBeat
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2026-05-06
www.newelectronics.co.uk
2026-05-06
New Electronics
As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up
2026-05-06
www.benzinga.com
2026-05-06
Benzinga
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2026-05-06
www.wsgr.com
2026-05-06
Wilson Sonsini
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2026-05-06
www.morningstar.com
2026-05-06
Morningstar
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2026-05-06
semiengineering.com
2026-05-06
Semiconductor Engineering
A new technical paper, “AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving,” was published by researchers at UC San Diego, Columbia University, Yonsei University, NVIDIA, and Samsung.Abstract“All current LLM serving systems place the GPU at the center, from production-level attention-FFN disaggregation to NVIDIA’s Rubin GPU-LPU heterogeneous platform. Ev
2026-05-06
www.semiconductor-today.com
2026-05-06
Semiconductor Today
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2026-05-06
www.marketwatch.com
2026-05-06
MarketWatch
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2026-05-06
www.zacks.com
2026-05-06
Zacks Investment Research
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