Semiconductor News & Analysis Feed

109 articles
2026-05-27
www.theregister.com 2026-05-27 The Register
AI+ML Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire Third-gen chips to use Broadzilla's advanced packaging, networking tech Tobias Mann Systems editor 0 Published Wed 27 May 2026 // 13:00 UTC Broadcom has added FuriosaAI to its list of partners building AI accelerators atop its chip packaging tech. After years quietly serving as the connective tissue behind many modern
2026-05-27
tomshardware.com 2026-05-27 Mark Tyson
A deep tech startup has come out of stealth brandishing a prototype of what it claims to be 'the world’s first fluid circuit board.'
2026-05-27
www.alternativeswatch.com 2026-05-27 Alternatives Watch
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2026-05-27
www.newelectronics.co.uk 2026-05-27 New Electronics
Share LinkedIn Teams WhatsApp Facebook Email X Neil Tyler 27 May 2026 More in Power RECOMMENDED ROHM unveils 5th-generation SiC MOSFETs with improved high-temperature efficiency Microchip increases hydrogen maser production with new Alabama facility Microchip compact crystal oscillator intended for high-stability timing applications Microchip unveils 3.3 kV SiC power modules for high-voltag
2026-05-27
www.digitimes.com 2026-05-27 digitimes
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the sit
2026-05-27
www.bisinfotech.com 2026-05-27 Bisinfotech
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2026-05-27
www.prnewswire.com 2026-05-27 PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English VOM NACHRICHTENDIENST USI 27 Mai, 2026, 05:00 GMT ARTIKEL TEILEN ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
www.moomoo.com 2026-05-27 Moomoo
To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here. May 27th - The industry of $Power semiconductor (LIST24211.HK)$ is trending higher today with 8 constituents up an
2026-05-27
www.thailand-business-news.com 2026-05-27 Thailand Business News
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2026-05-27
digitimes.com 2026-05-27
The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement preferences, and regulatory pressures affecting cross-border semiconductor adoption.
2026-05-27
digitimes.com 2026-05-27
The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.
2026-05-27
www.manilatimes.net 2026-05-27 The Manila Times
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com 2026-05-27 PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English NEWS PROVIDED BY USI 27 May, 2026, 07:00 CST SHARE THIS ARTICLE ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
us.acrofan.com 2026-05-27 acrofan.com
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.manilatimes.net 2026-05-27 The Manila Times
Visit ROHM at booth 318 in hall 9 Demonstrating cutting edge power semiconductor technologies. Get the latest news delivered to your inbox Sign up for The Manila Times newsletters By signing up with an email address, I acknowledge that I have read and agree to the Terms of Service and Privacy Policy. ADVERTISEMENT Santa Clara, CA and Willich/Nuremberg, Germany, May 26, 2026 (GLOBE NEWSWIRE) --
2026-05-27
ca.finance.yahoo.com 2026-05-27 Yahoo! Finance Canada
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2026-05-27
www.taiwannews.com.tw 2026-05-27 Taiwan News
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2026-05-26
www.bisinfotech.com 2026-05-26 Bisinfotech
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2026-05-26
www.presseagentur.com 2026-05-26 presseagentur.com
ROHM at PCIM Europe 2026: Advancing SiC Power Technology for E-Mobility and Industry Willich/Nuremberg, Germany, May 26, 2026 – ROHM will exhibit at PCIM Expo & Conference 2026, the leading international event for power electronics, intelligent motion, renewable energy and energy management – taking place June 9 to 11, 2026, in Nuremberg, Germany. This year, ROHM invites its visitors to booth 31
2026-05-26
timestech.in 2026-05-26 TimesTech
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