Semiconductor News & Analysis Feed

LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.

KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (

The Taiwanese government has launched an AI infrastructure initiative aiming to further strengthen its semiconductor industry prowess by leveraging silicon photonics (SiPh) to form a new moat, as AI-driven demand for high-speed data transfer accelerates.

LG Innotek is expanding semiconductor substrate production in Vietnam as rising demand for server components reshapes capacity across the substrate industry, fueling expectations that supply of RF-SiP substrates used in premium smartphones could tighten.

Simple in principle, challenging in execution

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.

SiPearl and Semidynamics have announced a partnership to build one of the first European sovereign rack-scale AI platforms.

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EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.