Semiconductor News & Analysis Feed
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2026-07-07
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2026-07-07
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2026-07-07
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2026-07-06
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2026-07-06
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조선일보
2026-07-06
digitimes.com
2026-07-06
The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest for market share among Samsung Electronics, SK Hynix, and Micron Technology.
2026-07-06
digitimes.com
2026-07-06
Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.
2026-07-06
digitimes.com
2026-07-06
Anthropic's reported move into in-house chip development could matter well beyond Silicon Valley if it helps lower the cost of running AI services worldwide. By prioritizing cheaper inference rather than elite performance, the startup may be signaling a more pragmatic path that could influence how global AI systems are built and priced.