Semiconductor News & Analysis Feed
164 articles
2026-07-16
digitimes.com
2026-07-16
Samsung Electronics is reportedly preparing to reduce a long-running preorder perk for its next Galaxy foldables as memory prices climb. According to ChosunBiz, the South Korean company will likely cut its "free storage upgrade" offer from a full double-capacity boost to a subsidy covering only half the price gap between the 256GB and 512GB versions.
2026-07-16
digitimes.com
2026-07-16
As Samsung Electronics pushes ahead with a major semiconductor investment project in South Korea's Honam region, including Gwangju and South Jeolla Province, labor-management relations have once again emerged as a source of uncertainty.
2026-07-16
digitimes.com
2026-07-16
Samsung Electronics and SK hynix are set to anchor a KRW800 trillion (US$532.4 billion) semiconductor cluster at the former Gwangju military airport site in South Korea. Industry experts describe the project as a race against time, with an ambitious target of bringing four fabrication plants online within four years. Whether land, power, water, talent, and supply-chain infrastructure can be develo
2026-07-16
digitimes.com
2026-07-16
Samsung Electronics is considering outsourcing some or all of the back-end design work for an input/output die in Google's reported 10th-generation tensor processing unit, as growing demand for Samsung's 2nm foundry process reportedly stretches its internal engineering resources.
2026-07-15
digitimes.com
2026-07-15
CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical integration, and challenge Samsung Electronics, SK Hynix, and Micron Technology under rising AI demand and tighter US export controls.
2026-07-15
digitimes.com
2026-07-15
Samsung Electronics has yet to receive a volume-production order from Nvidia for HBM4 chips, with its HBM revenue from the AI chipmaker so far limited to paid evaluation samples, Dealsitereported, citing semiconductor industry sources.
2026-07-15
digitimes.com
2026-07-15
A South Korean court has partially granted Samsung Electronics' request to prevent two former NAND flash design employees from working for rival SK Hynix or its affiliates until April 30, 2027, Yonhap News Agencyreported.
2026-07-14
digitimes.com
2026-07-14
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
2026-07-14
news.google.com
2026-07-14
디지털투데이
2026-07-13
news.google.com
2026-07-13
finance.biggo.com
2026-07-13
digitimes.com
2026-07-13
Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip scheduled to be manufactured at Samsung's Taylor, Texas, fab using the company's 2nm process.
2026-07-13
digitimes.com
2026-07-13
Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture that can deliver power from both sides of the chip. Industry observers say Intel and Samsung Electronics are both taking on harder-to-manufacture technologies in the ultra-advanced process race as they try to catch up with TSMC.
2026-07-13
digitimes.com
2026-07-13
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of schedule, increasing pressure on South Korea to accelerate the power, water and site development needed for a major semiconductor expansion.
2026-07-13
digitimes.com
2026-07-13
Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging high-performance chips, with prototypes potentially ready by the end of this year, The Elecreported, citing semiconductor industry sources.
2026-07-11
digitimes.com
2026-07-11
Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from Intel and AMD pushed back the broader PCIe 6.0 ecosystem, highlighting how AI infrastructure adoption increasingly depends on platform readiness rather than individual components.
2026-07-11
digitimes.com
2026-07-11
Samsung Electronics' preliminary results for the second quarter of 2026 again underscore a striking split inside the company: surging semiconductor profits driven by AI server demand are lifting overall earnings, while TVs, home appliances, and other end-device businesses remain under pressure.
2026-07-11
www.thelec.net
2026-07-11
thelec.net
2026-07-10
finance.biggo.com
2026-07-10
finance.biggo.com
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence analyst Luke Lin examined the actual progress of advanced-node capacity expansion at TSMC, Intel, and Samsung, arguing that market expectations in several areas have run ahead of reality.